Sony Interactive Entertainment Inc.

Ebara Corporation

Sony Corporation

Sony Computer Entertainment Inc.

Tsuyoshi Ohashi

Yoichi Kobayashi

Yasumasa Hiroo

Tsukasa Takahashi

Shinji Takashima

Motoki Katayama

Daiki Yanagidaira

Toru Umetsu

An electrical device having a plurality of parallel-connected built-in rechargeable batteries includes a power supply terminal and a charging circuit. The power supply terminal receives electrical power supplied from the outside of the electrical device. The charging circuit executes charge control so as to charge the plurality of rechargeable batteries using the electrical power supplied from the outside. During the execution of the charge control, the charging circuit interrupts charging of any one of the plurality of rechargeable batteries in accordance with a magnitude of a charging current flowing to each of the plurality of rechargeable batteries.

Electrical device for parallel connected batteries

An electric device includes a first rechargeable battery and a second rechargeable battery that is lower, in a full charge voltage, than the first rechargeable battery; a first power source circuit that steps down a voltage output by the first rechargeable battery to a first voltage and outputs the first voltage; and a second power source circuit that steps down a voltage output by the second rechargeable battery to a second voltage that is lower than the first voltage and outputs the second voltage.

Electric device for supplying multiple power outputs and recharging multiple supply batteries having different operating voltages

An electrical machinery and apparatus has a first rechargeable battery, and a second rechargeable battery different in characteristics from the first rechargeable battery built therein, the electrical machinery and apparatus including: a first charging circuit charging the first rechargeable battery; and a second charging circuit charging the second rechargeable battery. The second charging circuit charges the second rechargeable battery with an electric power supplied from an outside of the electrical machinery and apparatus, and the first charging circuit charges the first rechargeable battery with both the electric power supplied from the outside of the electrical machinery and apparatus, and an electric power supplied from the second rechargeable battery.

Electrical machinery and apparatus

An electrical apparatus incorporates a first rechargeable battery () and a second rechargeable battery () connected in parallel with the first rechargeable battery (), the second rechargeable battery () having an allowable maximum discharge current larger than that of the first rechargeable battery (). The electrical apparatus includes: a power supply path () configured to input power supplied from the first rechargeable battery () and from the second rechargeable battery () to a load (); and a discharge current limiting circuit connected serially with the first rechargeable battery () and configured to perform control in such a manner that a discharge current flowing from the first rechargeable battery () to the second rechargeable battery () and/or to the power supply path () does not exceed the maximum discharge current of the first rechargeable battery ().

Electrical apparatus

An electrical apparatus is provided which can reduce, when it is shipped in a state in which a secondary battery is built therein, power consumption before a user starts to use the electrical apparatus first. The electrical apparatus includes a secondary battery, a load which operates by power supplied from the secondary battery, and a switch element disposed between the secondary battery and the load. The switch element remains in an off state until a user starts use of the electrical apparatus.

Provided is an electric device, including: a secondary battery; and a power supply circuit for dropping an input voltage which is input from the secondary battery to an output voltage and outputting the output voltage to a load, in which the output voltage is stepwise dropped in accordance with the drop of the input voltage.

Electric device

Provided is a power supply circuit capable of suppressing a power supply voltage to be input to an integrated circuit device to low level. A power supply circuit () controls power supply to an integrated circuit device () having a built-in IC chip (). The power supply circuit () acquires a value of a current flowing in the integrated circuit device, and changes a power supply voltage to be input to the integrated circuit device (), in accordance with the acquired value of the current.

Power supply circuit for controlling power supply to an integrated circuit device with a rate of change of power supply voltage based on acquired value of current

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a semiconductor wafer, to planarize the substrate. The polishing apparatus according to the present invention includes a polishing table () having a polishing surface, a top ring () configured to press the substrate against the polishing table by applying pressing forces independently to first plural zones on the substrate, a sensor () configured to detect a state of the film at plural measuring points, a monitoring device () configured to produce monitoring signals with respect to second plural zones on the substrate, respectively, a storage device configured to store plural reference signals each indicating a relationship between reference values of each monitoring signal and polishing times, and a controller configured to operate the pressing forces against the first plural zones such that the monitoring signals, corresponding respectively to the second plural zones, converge on one of the plural reference signals.

Polishing apparatus and polishing method

A polishing apparatus has a polishing table having a polishing surface and a top ring for pressing a substrate against the polishing surface while independently controlling pressing forces applied to a plurality of areas on the substrate. The polishing apparatus has a sensor for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit for performing a predetermined arithmetic process on a signal from the sensor to generate a monitor signal, and a controller for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring so that the monitor signal of the measurement point converges on the reference signal.

A polishing apparatus has a polishing table () having a polishing surface () and a top ring () for pressing a substrate against the polishing surface () while independently controlling pressing forces applied to a plurality of areas (C-C) on the substrate. The polishing apparatus has a sensor () for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit () for performing a predetermined arithmetic process on a signal from the sensor () to generate a monitor signal, and a controller () for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring () so that the monitor signal of the measurement point converges on the reference signal.

A substrate transfer controlling apparatus can easily maximize throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling apparatus includes an input device for inputting times required for actions of transfer devices and times required to process substrates in processing devices, and a schedule calculator for calculating execution times of actions of the transfer devices for allowing a time when a final one of the substrates to be processed is fully processed and returned from the substrate processing apparatus to be earliest, based on a predetermined conditional formula including, as parameters, the inputted times. The substrate transfer controlling apparatus further includes an action commander for instructing corresponding transfer devices to perform actions at calculated execution times of the actions of the transfer devices.

Substrate transfer controlling apparatus and substrate transferring method

The present invention provides a substrate transfer controlling apparatus which can easily maximize the throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling apparatus comprises an input device () for inputting times required for actions of transfer devices (through) and times required to process substrates in processing devices (through), and a schedule calculator () for calculating execution times of actions of the transfer devices (through) for allowing the time when a final one of the substrates to be processed is fully processed and returned from the substrate processing apparatus to be earliest, based on a predetermined conditional formula including, as parameters, the inputted times. The substrate transfer controlling apparatus further comprises an action commander () for instructing the corresponding transfer devices to perform the actions at the calculated execution times of the actions of the transfer devices (through).

The present invention provides a substrate transfer controlling apparatus which can easily maximize the throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling apparatus comprises an input device ( ) for inputting times required for actions of transfer devices ( through ) and times required to process substrates in processing devices ( through ), and a schedule calculator ( ) for calculating execution times of actions of the transfer devices ( through ) for allowing the time when a final one of the substrates to be processed is fully processed and returned from the substrate processing apparatus to be earliest, based on a predetermined conditional formula including, as parameters, the inputted times. The substrate transfer controlling apparatus further comprises an action commander ( ) for instructing the corresponding transfer devices to perform the actions at the calculated execution times of the actions of the transfer devices ( through ).

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Tokyo, Japan

Tsuyoshi Ohashi