Central Glass Company, Limited

Tsuyoshi Ogawa

Kazuhiro Yamanaka

Junya Nakatsuji

Mitsuya Ohashi

Hiroshi H Eguchi

Hiroki Uoyama

Takeshi Suda

Masafumi Oda

Katsuhiro Akiyama

Yutaka Sugita

Yu Matsuno

Wataru Kawai

Yoshihiro Muramatsu

According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25&#xb0; C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Curable resin composition, cured product thereof, and semiconductor device using the same

Silane composition and cured film thereof, and method for forming negative resist pattern using same

Disclosed is a curable composition including a silicone (A) of a specific structure and a composition containing Si&#x2014;OH group and Si&#x2014;H group, a silicone (B) of a specific structure and a composition containing Si&#x2014;OH group and Si&#x2014;CH&#x2550;CHgroup, and a hydrosilylation catalyst of a catalytic quantity containing at least one metal compound selected from the group consisting of platinum compounds, palladium compounds, and rhodium compounds. In this curable composition, as kind of each silicone and the content of Si&#x2014;OH group are adjusted, in curing the silicone, foaming in a cured product can be inhibited by inhibiting a dehydration condensation reaction between Si&#x2014;OH groups, as compared with a hydrosilylation reaction which is a reaction of Si&#x2014;CH&#x2550;CHgroup and Si&#x2014;H group. Furthermore, an excellent adhesion to a base body such as semiconductor substrate can be given when making a cured film.

Curable composition containing silicone, and cured product thereof

[Problem] Diamine and carboxylic dianhydride for polymerizing a hexafluoroisopropylidene group-containing polyimide are limited in chemical structure when developed into a polyimide membrane, so that it is difficult to design a chemical structure with consideration paid to the strength and separation performance of a gas separation membrane. A gas separation membrane easily soluble in an organic solvent, excellent in formability so as to be readily usable for a gas separation membrane, and excellent in gas separation performance is obtained. [Solution] A gas separation membrane, including: 

Gas separation membrane

A modifier for lowering relative dielectric constant of a low dielectric constant film used in semiconductor devices, the modifier of the low dielectric constant film being characterized in that it contains as an effective component a silicon compound represented by formula (1)RHSiN&#x2003;&#x2003;(1)in which R is a C1-C4 alkyl group, and n is an integer from 0 to 3.

Modifier for low dielectric constant film, and method for production thereof

By reducing an organosilane represented by the formula (1),SiXR&#x2003;&#x2003;(1)(wherein X represents a halogen or alkoxide, n represents an integer of 1-3, and R represents an alkyl group or aryl group), there is produced a corresponding organosilane represented by the formula (2),SiHR&#x2003;&#x2003;(2)(wherein n represents an integer of 1-3, and R represents an alkyl group or aryl group). In this production method, an aromatic hydrocarbon series organic solvent is used as a reaction solvent, and aluminum lithium hydride is used as a hydrogenating agent.

Method for producing organosilane

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Saitama, Japan

Tsuyoshi Ogawa