Sony Corporation

Kabushiki Kaisha Toshiba

Toshiba Energy Systems & Solutions Corporation

Tsuyoshi Ogawa

Akihiko Okubora

Kazuyoshi Yamada

Hirohito Miyazaki

Yuji Nishitani

Hirokazu Nakayama

Hiroshi Asami

Akira Muto

Kenji Kamimura

Takahiko Kosemura

Yoichi Oya

Fujio Kanayama

Masahiro Yamada

Yoshihiro Fujita

Takahiro Miura

Makoto Ochiai

Daiki Tanaka

Masahiro Yoshida

Takeshi Hoshi

Satoshi Nagai

Terukazu Naruse

Satoru Asai

Jun Semboshi

Kazumi Watanabe

Setsu Yamamoto

Takashi Mizoroki

Toru Terada

Shozo Hirano

Shuichi Otaki

Namiko Takeshima

Takahiro Niki

Shinichiro Nakamura

Shinsaku Amano

A rotor blade in an embodiment includes: a suction surface side projecting portion projecting from a suction surface on a leading edge side at a blade tip of the blade effective portion; and a pressure surface side projecting portion projecting from a pressure surface on a trailing edge side at the blade tip of the blade effective portion. The suction surface side projecting portion includes: a leading edge side end surface including a contact surface that comes into contact with the pressure surface side projecting portion of the adjacent rotor blade and a non-contact surface that does not come into contact with the pressure surface side projecting portion of the adjacent rotor blade during rotation; a groove portion formed from the non-contact surface to the trailing edge side; and a joining member joined to the groove portion, the joining member being formed of an erosion-resistance material.

Turbine rotor blade

According to an embodiment, a method of correcting a bend of a joint type-turbine rotor comprises: measuring displacement of a convex portion of the bend at a joined portion of the joint type-turbine rotor or displacement of a surface opposite to the convex portion in a circumferential direction of the joint type-turbine rotor; heating the convex portion; and cooling the joined portion after the step of heating. The steps of heating and cooling are performed during the step of measuring.

Method of correcting bend of joint type-turbine rotor

There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.

Optical-electrical hybrid module

[Object] To provide an optical connector and an optical connector set which are excellent in environment resistance and suitable for the use in medical instruments, an image pickup unit and an image pickup system that use the optical connector, and an optical transmission module. [Solving Means] An optical connector according to the present technology includes a lens support, a fiber ferrule, a lens, and a lens retainer. The lens support includes a through-hole. An optical fiber is connected to the fiber ferrule. The fiber ferrule is press-fitted in the through-hole. The lens is inserted into the through-hole. The lens retainer is press-fitted in the lens support and sandwiches the lens between the lens retainer and the fiber ferrule.

Optical connector, optical connector set, image pickup unit, image pickup system, and optical transmission module

An optical communication fiber includes: a fiber body having a tip surface; and a light absorption layer provided to the tip surface of the fiber body, and configured to reduce light transmittance of communication light.

Optical communication fiber, optical communication module, and optical communication system

An optical module includes: a substrate provided with a through hole for inserting an optical fiber from a second principal surface side of the substrate; an optical device provided on a first principal surface side of the substrate; a first electrode provided in the substrate for connecting an electric fiber from the second principal surface side; a second electrode formed on the first principal surface side of the substrate for connecting to the optical device; and a third electrode provided on a side surface of the substrate and electrically connected to the second electrode.

Optical module, manufacturing method of optical module and optical communication device

A welding inspection method has steps of: generating transmission laser light for generating an ultrasonic wave and transmitting the transmission laser light to an object to be inspected during or after welding operation for irradiation; generating reception laser light for detecting an ultrasonic wave and transmitting the reception laser light to the object to be inspected for irradiation; collecting laser light scattered and reflected at surface of the object to be inspected; performing interference measurement of the laser light and obtaining an ultrasonic signal; and analyzing the ultrasonic signal obtained by the interference measurement. At least one of the transmission laser light generated in the transmission laser light irradiation step and the reception laser light generated in the reception laser light irradiation step is irradiated onto a welded metal part or a groove side surface.

Welding inspection method and apparatus thereof

An optical fiber cable processing device includes a transport mechanism which transports a case that accommodates an optical fiber cable and in which plural work stations are set along a transport path, and a processing mechanism that performs each of desired operations on the optical fiber cable, in which any one of the plural work stations is a mounting station in which a work mounting mechanism mounts a work on a tip of the optical fiber cable, a drawing mechanism that draws out the optical fiber cable and a correction mechanism that corrects a bending tendency of the optical fiber cable are disposed in the work stations on an upstream side of the mounting station, and the transport mechanism transports the case to the mounting station and mounts the work on the tip of the optical fiber cable in a state where the optical fiber cable is drawn out.

Optical fiber cable processing device, method for processing the same, and case for optical fiber cable

A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.

Hybrid module and method of manufacturing the same

This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit () in which first to third unit wiring layers () to (), each having a capacitor () or the like at a part, are stacked and formed on flattened one surface of a dummy board () so that a third pattern wiring is exposed from a connection surface () of an uppermost layer is mounted on a mounting surface () of a base board () where an input/output terminal part () is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

Method for manufacturing high-frequency module device

The present invention is directed to a multi-layer interconnection circuit module in which plural unit wiring layers are interlayer-connected to each other through a large number of via holes so that they are laminated and formed, wherein respective unit wiring layers () to () are adapted so that photo-lithographic processing is implemented to a first insulating layer () formed by photosensitive insulating resin material to form via hole grooves (), and photo-lithographic processing is implemented to a second insulating layer () formed by photosensitive insulating resin material on the first insulating layer () to form wiring grooves (). A conductive metal layer () is formed on the second insulating layer () in such a manner that conductive metal is filled within the via hole grooves () and the wiring grooves () to implement polishing processing to the conductive metal layer () until the principal surface of the second insulating layer () is exposed to form via holes () and wiring patterns () by the conductive metal filled within the via hole grooves () and the wiring grooves ().

Multi-layer interconnection circuit module and manufacturing method thereof

An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Optical waveguide and method for producing same

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Kanagawa, Japan

Tsuyoshi Ogawa