M. Setek Co., Ltd.

Teoss Co., Ltd.

Tsuyoshi Murai

Toshinori Konaka

Takashi Itoh

Hiroyuki Saitoh

Haruyuki Kinami

Shigeru Mizuno

Shigeaki Nakamura

The raw silicon crusher comprises a pair of beds; and a pair of crushing surfaces on the beds crushing the quenched pure raw silicon by applying pressure; wherein each of the beds comprises a case; pure silicon members arranged inside of the case and protruding from the opening; a block of pure ice fixing the pure silicon members to the case, and each of the crushing surfaces comprises surfaces of ends of protrusions; and surface of the block of ice.

Raw silicon crusher

An improved method for scrubbing a substrate, the method including the step of scrubbing one face of the substrate with a cylindrical rotary brush while applying back pressure to the substrate by jetting a fluid for generating back pressure against the other face of the substrate.

Method for scrubbing substrate

Improved method and apparatus for scrubbing a substrate are provided, the method including the step of scrubbing one face of the substrate with a cylindrical rotary brush while applying back pressure to the substrate by jetting a fluid for generating back pressure against the other face of the substrate.

Apparatus for scrubbing substrate

A method of fabricating a semiconductor substrate is characterized in that a semiconductor wafer is disposed between a pair of opposite electrodes provided in an atmosphere of inert gas containing impurity gas which is held at a low pressure, a low-frequency alternating current is applied between the electrodes to induce plasma, and impurity ions are implanted into the surface of the semiconductor wafer to form a very shallow impurity diffusion layer.

Growing community of inventors

Tokyo, Japan

Tsuyoshi Murai