Omron Corporation

Rohm Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Tsuyoshi Miyata

Hiroyuki Mizusaki

Jumpei Nakamura

Tomohiro Tsuji

Kiyoshi Imai

Jun Nakajima

Seiji Miyashita

Kazuya Ohtsuki

Heita Nada

Kazunari Komai

Makoto Sugimoto

Motoharu Okuno

Satoshi Hirono

Takamasa Kameda

Makoto Kasuya

Tetsuro Oki

Naoto Inoue

Manabu Ikoma

Hiroshi Kawano

Yuki Ushiro

Kiyohiko Gondo

Koichiro Harada

Motoki Tanaka

Ryuichi Neki

Yoshio Murakami

Yasuyoshi Sawada

Hideki Otsuka

Muneyuki Matsumoto

Kazuo Kawakami

Kozo Matsuo

Yoshiki Tani

Hidekazu Ohara

A sensor includes a metal housing and a metal lid. The metal housing houses a circuit board electrically connected to a sensor element and is provided with an opening and an edge part defining the opening. The metal lid is adhered to the edge part to cover the opening. At least one of the edge part and the metal lid is provided with one or more recesses, and the metal lid is adhered to the edge part by a portion of an adhesive agent filled in the recess that is located in a region of an opening end of the recess.

Sensor

Provided is a sensor which makes it easy to mount a cable to a circuit board. This sensoris provided with: a circuit board; a connectorwhich is composed of a metal material and which is fixed to the circuit board; and a cablewhich is connected to the circuit boardvia the connector. The connectorhas: a bottom partthat is connected to the circuit board; and a pair of pinching elementsL,R that are raised upright from said bottom part. The cableis held in a space S between the pair of pinching elementsL,R.

Sensor and sensor manufacturing method

Photoelectric sensor

Provided is a photoelectric sensor that enables manufacturing of a sensor with high environmental durability in a case in which there is more variation in case bodies. A photoelectric sensor includes: a package that includes an optical unit and a sealing member that seals the optical unit, and the optical unit includes at least any one of a light projecting portion that emits light and a light receiving portion that detects light; and a case body that accommodates the package, and a gap is provided between the package and the case body.

Photoelectric sensor and manufacturing method thereof

A photoelectric sensor capable of suppressing breakage of a cable connected to a case body is provided. The photoelectric sensor includes a case body having an accommodation space which accommodates at least one of a light projecting portion and a light receiving portion therein, and a cable which accommodates a cord connected via a control portion to at least one of the light projecting portion and the light receiving portion, and a concave portion recessed toward an inside of the case body is provided in an outer surface of the case body, and the cable is mounted in the concave portion.

Photoelectric sensor capable of suppressing cable breakage

A photoelectronic sensor or the like capable of improving operation stability is provided. The photoelectronic sensor includes a light projecting unit having a light projecting lens that converges light and a light projecting element that projects light toward a reflective plate via the light projecting lens, and a light receiving unit disposed alongside the light projecting unit and having a light receiving lens that concentrates reflected light from the reflective plate and a light receiving element that receives the reflected light via the light receiving lens. The light projecting element has a light emitting area located on a side closer to the light receiving element than an optical axis of the light projecting lens and emitting light, and a non-light emitting area located on a side farther from the light receiving element than the optical axis and not emitting light.

Photoelectronic sensor and sensor system

A photoelectric sensor capable of saving a space is provided. A photoelectric sensor includes a case body with a substantially rectangular parallelepiped shape that accommodates at least one of a light projecting section and a light receiving section. The case body has a front surface that has a light projecting and receiving surface that allows at least one of light from the light projecting section and light to the light receiving section to pass therethrough and a rear surface that is located on a side opposite to the front surface, and a cable that accommodates cords that are connected to at least one of the light projecting section and the light receiving section via a control section is attached to the rear surface.

A photosensor is provided with a sensor circuit assembly. The sensor circuit assembly includes alight emitter, a light receiver, a light-emitter support, a light-receiver support, and a connecting part. The light emitter and the light receiver face each other. The light-emitter support extends from and supports the light emitter. The light-receiver support extends from and supports the light receiver. The connecting part connects one end of the light-emitter support with one end of the light-receiver support. The connecting part includes a seal and a connection terminal that protrudes from the seal. The connection terminal includes a first press-contact part, and a first pressure part that presses the first press-contact part in a press-contact direction.

Photosensor including sensor circuit assembly with light emitter and receiver that face each other

An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10seconds to 10seconds.

Optical fiber and manufacturing method thereof

A photosensor includes a sensor module in which emitter and receiver leads protrude from a circuit-encapsulating portion in a direction intersecting with a direction in which an external connecting terminal extends. The photosensor includes a light emitter, a light receiver, a circuit-encapsulating portion, a connecting terminal, first and second emitter leads, and first and second receiver leads. When the connecting terminal extends in a first direction, and a first plane is parallel to the first direction, the first and second emitter leads protrude from the circuit-encapsulating portion in a direction parallel to the first plane and intersecting with the first direction, and extend opposite to the first direction. The first and second receiver leads protrude from the circuit-encapsulating portion in the direction parallel to the first plane and intersecting with the first direction and opposite to a direction in which the first and second emitter leads protrude, and extend opposite to the first direction. The first and second emitter leads and the first and second receiver leads are deformed to allow the light receiver and the light emitter to face each other.

Photosensor having emitter and receiver leads protruding from circuit-encapsulating portion to connect to light emitter and light receiver, respectively

A photosensor is provided with a sensor circuit assembly. The sensor circuit assembly includes a light emitter, a light receiver, a light-emitter support, a light-receiver support, and a connecting part. The light emitter and the light receiver face each other. The light-emitter support extends from and supports the light emitter. The light-receiver support extends from and supports the light receiver. The connecting part connects one end of the light-emitter support with one end of the light-receiver support. The connecting part includes a seal and a connection terminal that protrudes from the seal. The connection terminal includes a first press-contact part, and a first pressure part that presses the first press-contact part in a press-contact direction.

A photosensor includes an emitter element, an emitter-encapsulating portion, a receiver element, a receiver-encapsulating portion, a circuit portion, and a circuit-encapsulating portion. The emitter-encapsulating portion encapsulates the emitter element. The receiver-encapsulating portion encapsulates the receiver element. The circuit portion includes a luminous element for indicating an operation. The circuit-encapsulating portion encapsulates the circuit portion. The circuit-encapsulating portion includes an operation indicator portion facing the luminous element. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are connected to one another with a conductive leadframe. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are formed from the same resin material containing a light diffusing agent.

Photosensor having an emitter-encapsulating portion, receiver-encapsulating portion, and circuit-encapsulating portion connected to one another with a conductive leadframe

Growing community of inventors

Kyoto, Japan

Tsuyoshi Miyata