Mitsubishi Electric Corporation

Hitachi Metals, Ltd.

Proterial, Ltd.

Waseda University

Tsuyoshi Miura

Makoto Iwasaki

Hirofumi Nakano

Yoshiaki Nakamura

Keiji Kimura

Tamotsu Kibe

Masahiro Koyama

Hironori Kasahara

Hiroyuki Okuda

Takumi Nito

Takanori Maruyama

Tomohiro Tagawa

Kazuo Namikoshi

Tomotaka Kojima

Taisuke Hirooka

Hodaka Ichikawa

Naoya Kimura

A method for manufacturing a silicon carbide epitaxial substrate which has a first surface which is a (000-1) C-face, a silicon carbide epitaxial layer located on the first surface of the silicon carbide substrate, and a line-shaped surface defect density on a top surface of the silicon carbide epitaxial layer is less than 1.0 cmand a stacking fault density is less than 1.2 cm.

Silicon carbide epitaxial substrate and method for manufacturing same

To achieve heat dissipation of a wiring pattern inexpensively with a simple configuration, a printed circuit board includes an insulating substrate having a plurality of wiring patterns on a main surface thereof, and an electronic component mounted on the main surface and connected to the wiring patterns. Further, the printed circuit board includes a heat-dissipating surface mount component that is a surface mount component. The heat-dissipating surface mount component is joined via a solder to each of the wiring patterns on the main surface to dissipate heat of the wiring pattern.

Printed circuit board, air conditioner, and method for manufacturing printed circuit board

In a multi-layer insulated wire including: a conductor; an inner layer formed in periphery of the conductor; and an outer layer formed in periphery of the inner layer, the inner layer is made of a resin composition containing a base polymer containing polyolefin as a main component, and the outer layer is made of a resin composition containing a base polymer containing polyolefin as a main component so as to contain 80 or more and 250 or less parts by mass of metallic hydroxide per 100 parts by mass of the base polymer. The multi-layer insulated wire having an expansion start temperature of the outer layer that is equal to or lower than 344&#xb0; C. is used.

Multi-layer insulated wire and method of manufacturing the same

A printed wiring board has a solder-land group for placing a quad flat package IC, and the solder-land group consists of front solder-land groups and rear solder-land groups. The printed wiring board includes rear solder-drawing lands that are positioned adjacent to rear solder-land groups, that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands constituting the rear solder-land group and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands is made wider in its rearward portion than that in its frontward portion, and that have a slit substantially parallel to the longitudinal direction near the front edge.

Printed wiring board, method of soldering quad flat package IC, and air conditioner

Provided is a method for managing a memory storage region used by a processor. The processor is connected to the memory that stores data accessed while a task is being executed. The memory management method including the steps of: dividing the memory area of the memory into blocks having a plurality of different sizes; selecting a block having a size matching a size of the data accessed while the task is being executed; and storing the data accessed while the task is being executed in the selected block.

Memory management method, information processing device, program creation method, and program

A printed circuit boardis provided, which includes: soldering lands for connecting respective leads of a dual inline lead-type electronic partby jet-type soldering; and a solder-drawing landfor absorbing excessive solder during soldering, which is arranged at a position behind the rearmost soldering landsin the traveling direction of jet-type soldering. The solder-drawing land has a square outer shape and includes a slitin a bent shape therein. One corner of the square is located near the rearmost soldering landsand arranged between the leads, while a bent portion of the slit is arranged near the one corner.

Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner

A printed circuit boardincluding a group of consecutive soldering landsfor soldering a lead-type electronic partwith a plurality of leads, includes a solder drawing landhaving a cross-shaped slitand being provided adjacently to a rearmost portion of the group of the consecutive soldering lands

Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner

A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead flat package IC, has solder drawing lands, in a neighboring area, between the front soldering land groups and the rear soldering land groups adjacent to the front soldering land groups, and/or a trailing area of the rear soldering land groups. The solder drawing lands are formed with slits substantially parallel to the lines of soldering lands of the front soldering land groups or the rear soldering land groups placed in front of the solder drawing lands. These result in an advantageous effect of enabling the prevention of the occurrence of soldering bridges and soldering residues in the front soldering land groups or the rear soldering land groups.

Growing community of inventors

Tokyo, Japan

Tsuyoshi Miura