Screen Semiconductor Solutions Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Sokudo Co., Ltd.

Screen Holdings Co., Ltd.

Tsuyoshi Mitsuhashi

Yoshiteru Fukutomi

Kenya Morinishi

Hiroyuki Ogura

Yasuo Kawamatsu

Hiromichi Nagashima

Kenji Sugimoto

Katsushi Yoshioka

Tadashi Miyagi

Masakazu Sanada

Minobu Matsunaga

Masashi Kanaoka

Kazuhito Shigemori

Satoshi Yamamoto

Takashi Taguchi

Toru Asano

Kaoru Aoki

Mitsumasa Kodama

Moritaka Yano

Takashi Nagao

Yukio Toriyama

Koji Kaneyama

Shuichi Yasuda

Yukihiko Inagaki

Tsuyoshi Okumura

Takehiro Wajiki

Koji Hashimoto

Kenji Kamei

Yoshihisa Yamada

Kenji Hashinoki

Seiichiro Okuda

Naoyuki Osada

Takuya Wada

Atsushi Tanaka

Takashi Ito

Masanori Imamura

Hidetoshi Sagawa

Osamu Tamada

Takeo Okamoto

Noriaki Yokono

Manabu Yabe

Kazuhiro Tadokoro

Kazuya Ono

Shinichi Takada

Tetsuro Yamashita

Tamihiro Bun

Kinya Murata

Taiji Matsu

A substrate treating apparatus for treating substrates includes a plurality of substrate treatment lines arranged vertically for carrying out plural types of treatment on the substrates while transporting the substrates substantially horizontally, and a controller for changing processes of treatment carried out on the substrates for each of the substrate treatment lines. By changing the processes of treatment carried out for the substrates for each substrate treatment line, the processes of treatment carried out for the substrates can be changed for each substrate conveniently. Thus, a plurality of different processes of treatment corresponding to the number of substrate treatment lines can be carried out in parallel for the respective substrates.

Substrate treating apparatus with parallel first and second parts of substrate treatment lines on multiple stories for simultaneously treating a plurality of substrates

In a substrate processing apparatus, neutralization processing is performed on a substrate by a neutralization device provided in a thermal processing section. In the neutralization device, at least one of a holder that holds the substrate and an emitter that emits vacuum ultraviolet rays is moved relative to another one in one direction. At this time, one surface of the substrate is irradiated with the vacuum ultraviolet rays emitted by the emitter. When the entire one surface of the substrate is irradiated with the vacuum ultraviolet rays, the neutralization processing ends. Thereafter, the substrate on which the neutralization processing has been performed is transported to a coating processing unit in a coating processing section. In the coating processing unit, a film of a processing liquid is formed on the one surface of the substrate on which the neutralization processing has been performed.

Substrate processing apparatus and substrate processing method

A substrate treating method includes a determining step for determining a treating condition for hydrophobizing a surface of a substrate, based on a target regarding a dissolved area size in a resist pattern, and a treating step for hydrophobizing the surface of the substrate with the treating condition determined in the determining step before forming resist film on the surface of the substrate.

Substrate treating method

A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

Substrate treating apparatus with parallel gas supply pipes and a gas exhaust pipe

A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.

Substrate processing apparatus

A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.

Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units

A treating section has substrate treatment lines arranged one over the other for treating substrates while transporting the substrates substantially horizontally. An IF section transports the substrates fed from each substrate treatment line to an exposing machine provided separately from this apparatus. The substrates are transported to the exposing machine in the order in which the substrates are loaded into the treating section. The throughput of this apparatus can be improved greatly, without increasing the footprint, since the substrate treatment lines are arranged one over the other. Each substrate can be controlled easily since the order of the substrates transported to the exposing machine is in agreement with the order of the substrates loaded into the treating section.

Substrate treating apparatus with substrate reordering

Substrate treating apparatus with parallel substrate treatment lines simultaneously treating a plurality of substrates

Substrate treating apparatus

A joint nozzle that delivers a developer, a rinsing liquid and nitrogen gas is disposed adjacent the spin center of a substrate in plan view. A controller operates electromagnetic switch valves to continue supply of the developer, while spinning the substrate, in a developing process, and to start supply of the rinsing liquid in a rinsing process, immediately after the supply of the developer ends, thereby achieving a shortened period of the developing process. A switching is made to a drying process by starting supply of the nitrogen gas immediately after completion of the rinsing process. Thus, even if the substrate has a large angle of contact, formation of droplets of the rinsing liquid is inhibited to prevent post-develop defects.

Developing apparatus and developing method

A treating section includes a plurality of treating blocks juxtaposed horizontally. Each treating block is vertically divided into stories. Each story includes treating units and a main transport mechanism. Substrates are transportable between the same stories of the treating blocks. Further, the substrates are transportable between different stories. Thus, the apparatus can transport the substrates flexibly between the treating blocks.

A substrate treating apparatus includes a treating block including a plurality of cells arranged one over another. Each cell has treating units for treating substrates and a single main transport mechanism disposed in a transporting space for transporting the substrates to the treating units. The treating units include solution treating units and heat-treating units. The solution treating units are arranged at one side of the transporting space, the heat-treating units are arranged at the other side of the transporting space, and the main transport mechanism and the treating units are in substantially the same layout in plan view for the respective cells. The solution treating units are in substantially the same layout in side view for the respective cells, the heat-treating units are in substantially the same layout in side view for the respective cells, and treatments of the substrates carried out in the respective cells are the same.

Substrate treating apparatus using horizontal treatment cell arrangements with parallel treatment lines

A substrate treating apparatus includes a treating block including a plurality of cells arranged one over another. Each cell has treating units for treating substrates and a single main transport mechanism for transporting the substrates to the treating units. Each cell also has a blowout unit for supplying a clean gas into a transporting space of the main transport mechanism and an exhaust unit for exhausting gas from the transporting space. The blowout unit and the exhaust unit are arranged one over the other in the transporting space to separate the transporting space of each cell from that of another cell.

Substrate treating apparatus with vertical treatment arrangement including vertical blowout and exhaust units

After a developing step, a substrate is spun at high speeds without supplying a cleaning liquid to a surface of the substrate. This causes a large centrifugal force to act on a developer on a resist film. Consequently, the developer can be removed rapidly from the surface of the substrate. As a result, development can be stopped at an expected timing. Moreover, a circuit pattern having an expected dimension can be obtained. At this time, a dissolved product is also removable with the developer from the substrate. This can avoid failure in development caused by the dissolved product. Consequently, suitably maintained quality of negative development can be achieved with a reduced usage amount of the cleaning liquid.

Negative developing method and negative developing apparatus

A substrate treating apparatus includes a plurality of substrate treatment lines arranged vertically. Each substrate treatment line has a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each main transport mechanism for treating substrates. A series of treatments is carried out for the substrates, with each main transport mechanism transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto. The substrate treating apparatus realizes increased processing capabilities by treating the substrates in parallel through the substrate treatment lines.

Parallel substrate treatment for a plurality of substrate treatment lines

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Kyoto, Japan

Tsuyoshi Mitsuhashi