Senju Metal Industry Co., Ltd.

Tsuyoshi Masaki

Ryo Saito

Tomoko Nagai

Tetsu Takemasa

Kazuyori Takagi

Nanako Miyagi

Yutaka Hashimoto

Megumi Hayakawa

Mutsuki Kaneko

A flux containing rosin, a solvent, a thixotropic agent, a thiol compound, and an activator, in which the thiol compound includes a compound (Tp) having a benzenethiol skeleton in which one or more hydrogen atoms on a benzene ring are substituted with a mercapto group (—SH), is provided in the present invention. As the compound (Tp), at least one thiol compound selected from the group consisting of 2-aminobenzenethiol, 4-aminobenzenethiol, 3-aminobenzenethiol, and benzenethiol is preferable. According to such flux, a change in viscosity of the solder paste with time can be further suppressed.

Flux and solder paste

A flux containing rosin, a solvent, a thixotropic agent, an amine hydroiodide, and an activator (provided that the amine hydroiodide is excluded), in which the amine hydroiodide includes a heteroalicyclic amine hydroiodide, is provided in the present invention. As the heteroalicyclic amine hydroiodide, at least one selected from the group consisting of piperidine hydroiodide and pipecholine hydroiodide is preferable. According to such flux, the generation of voids during soldering can be further suppressed.

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Tokyo, Japan

Tsuyoshi Masaki