Kabushiki Kaisha Toshiba

Tsuyoshi Kumamoto

Ryota Suzuki

Taihei Nakada

Yuusuke Yamashita

Hiroyuki Kayano

Tamio Kawaguchi

Masahiro Tanabe

According to one embodiment, an array antenna apparatus includes a distributor, transmission phase shifters, transmission amplifiers, transmission filters, transmission/reception switches, limiters, reception filters, low-noise amplifiers, reception phase shifters, a combiner, a vacuum vessel, a refrigerating unit, and a cooling plate.

Array antenna apparatus

A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

Multilayer high-frequency circuit board

A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.

Growing community of inventors

Yokohama, Japan

Tsuyoshi Kumamoto