Toyo Tire Rubber Co., Ltd.

Kyocera Corporation

Keyence Corporation

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Tsuyoshi Kimura

Kazuyuki Ogawa

Atsushi Kazuno

Tetsuo Shimomura

Yoshiyuki Nakai

Koichi A Ono

Masahiko Nakamori

Takatoshi Yamada

Shigeru Komai

Takeshi Fukuda

Junji Hirose

Takashi Masui

Masahiro Watanabe

Hiroshi Seyanagi

Katsunari Koyama

Satoshi Kitayama

Shinya Ishikawa

Daisuke Ota

Takashi Koide

Takeshi Oyama

Motoki Shibahara

An insulation paste for forming a protective layer of a solar cell device includes: a siloxane resin; an organic solvent; and multiple fillers each having a surface covered with an organic coating containing at least one material different from a material of the siloxane resin. A method for producing the insulation paste includes: preparing the multiple fillers; and mixing together a precursor of the siloxane resin, water, a catalyst, an organic solvent, and the multiple fillers. A method for manufacturing a solar cell device includes: applying the insulation paste to the passivation layer; and drying the insulation paste to form the protective layer on the passivation layer. A solar cell device includes: the passivation layer located on a semiconductor region; and the protective layer located on the passivation layer and including a siloxane resin and dimethylpolysiloxane.

Insulation paste, method for producing insulation paste, method for manufacturing solar cell device, and solar cell device

A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

Polishing pad

An object of the invention is to provide a polishing pad that is prevented from slurry leaks and has high optical detection accuracy. The present invention relates to a polishing pad comprising a polishing region, a cushion layer, and a support film layered in this order, wherein a light-transmitting region is provided on the support film and in an opening part that passes through the polishing region and the cushion layer; the light-transmitting region has a peripheral part and a recessed part on the surface of a polishing platen-side; the support film is layered on the peripheral part; and the support film is not layered on the recessed part, which remains open.

An object of the present invention is to provide a polishing pad which enables high accuracy optical end-point detection in a state where polishing is carrying out, and which can prevent slurry leakage from a polishing layer to a cushion layer even in the case of being used for a long period. Another object is to provide a method for producing a semiconductor device using the polishing pad. The present invention relates to a polishing pad in which a polishing layer having a polishing region and a light-transmitting region, and a cushion layer having a through hole are laminated via a double-sided adhesive sheet such that the light-transmitting region and the through hole are laid one upon another, wherein a transparent member is stuck on an adhesive layer of the double-sided adhesive sheet in the through hole.

An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.

A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.

Polishing pad, method of producing the same and method of producing semiconductor device by using the same

The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Polishing pad and method of producing the same

A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4'-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan &#x3b4; peak temperature of 100&#xb0; C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4&#x2032;-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan &#x3b4; peak temperature of 40&#xb0; C. or less, and (3) 4,4&#x2032;-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.

A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a polishing region and a light-transmitting region, wherein the light-transmitting region includes a polyurethane resin having an aromatic ring density of 2 wt % or less, and the light transmittance of the light-transmitting region is 30% or more in the overall range of wavelengths of 300 to 400 nm.

A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side) and is capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. The polishing pad includes at least a transparent support film laminated on one side of a polishing layer including a polishing region and a light-transmitting region; the light transmittance of an optical detection region containing at least the light-transmitting region and the transparent support film is 40% or more in the overall range of wavelengths of 300 to 400 nm.

Grinding pad and method of producing the same

A CPU unithas a liquid crystal display screen, a plurality of operation keys, and the like. Each of expansion unitstohas a push switch button. For example, when an operator pushes the switch button-of the ID-unit, information concerning the unitis displayed on the liquid crystal screen. Next, the operator operates one of the predetermined operation keysof the CPU unit, whereby the display contents of the screenare removed and another piece of information concerning the unitis displayed.

Growing community of inventors

Osaka, Japan

Tsuyoshi Kimura