Murata Manufacturing Co., Ltd.

Tsuyoshi Katsube

Ryosuke Takada

Yusuke Kamitsubo

Yoichi Moriya

Machiko Motoya

Masaaki Hanao

Shigeru Tago

Yasutaka Sugimoto

Mitsuyoshi Nishide

Takahiro Sumi

Hiromichi Kawakami

Jun Urakawa

Yasuhiro Kuratani

Kazuo Kishida

Tsutomu Tatekawa

Takahiro Takada

Yuki Takemori

Tetsuo Kanamori

Tomohiro Furumura

A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

Resin multilayer substrate and method for manufacturing resin multilayer substrate

A composite substrate that includes: an upper ceramic layer; a lower ceramic layer; a middle resin layer between the upper ceramic layer and the lower ceramic layer; and a side surface resin layer on all side surfaces of the composite substrate, wherein the middle resin layer and the side surface resin layer are integral resin layers.

Composite substrate and method for manufacturing composite substrate

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

Laminated body and method for manufacturing the same

A multilayer substrate that includes a first ceramic layer that is a dense body, a second ceramic layer that has open pores, and a resin layer adjacent the second ceramic layer, wherein a material of the resin layer is present in the open pores of the second ceramic layer.

Multilayer substrate

A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

Resin multilayer substrate and electronic apparatus

A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

A ceramic multilayer substrate that includes a ceramic insulator layer, which includes a first layer, a second layer, and a third layer and in which the first layer is interposed between the second layer and the third layer, an inner pattern conductor, an outer pattern conductor, and outer electrodes. The ceramic insulator layer is interposed between the inner pattern conductor and the outer pattern conductor. The sintering shrinkage start temperatures of the second layer alone and the third layer alone in a green sheet state are higher than or equal to the sintering shrinkage stop temperature of the first layer alone in a green sheet state. The thickness of the ceramic insulator layer is 5.0 &#x3bc;m to 55.7 &#x3bc;m. The ratio of the total of the thickness of the second layer and the thickness of the third layer to the thickness of the first layer is 0.25 to 1.11.

Ceramic multilayer substrate

In a ceramic multilayer substrate formed by stacking and firing a plurality of insulating layers, the insulating layer in an uppermost surface layer includes a ceramic layer, a contraction suppression layer stacked on the ceramic layer, and a surface-layer via conductor penetrating through the ceramic layer and the contraction suppression layer and having a tapered shape gradually tapering toward the lower layer side. The surface-layer via conductor has an end surface that is exposed from the contraction suppression layer forming the surface of the ceramic multilayer substrate, and that is directly connected to a terminal of a component mounted to the surface of the ceramic multilayer substrate. A weight ratio of alumina contained in the contraction suppression layer is set higher than a weight ration of alumina contained in the ceramic layer.

In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu&#x2014;Ba&#x2014;Si based glass with a thickness of about 1 &#x3bc;m to about 5 &#x3bc;m is formed between the metal substrate and the low-temperature sintering ceramic layer.

Metal base substrate and manufacturing method thereof

Provided is a mono- or multilayer ceramic substrate which exhibits a high flexural strength. The substrate contains a sintered ceramic which includes respective crystal phases of quartz, alumina, fresnoite, sanbornite, and celsian, in which the relationship between the diffraction peak intensity A in the (201) plane of the fresnoite and the diffraction peak intensity B in the (110) plane of the quartz, measured by a powder X-ray diffractometry in the range of the diffraction peak angle&#x3b8;=10 to 40&#xb0;, is A/B&#x2267;2.5. The fresnoite crystal phase preferably has an average crystal grain size of 5 &#x3bc;m or less. In firing to obtain this ceramic sintered body, the maximum temperature falls within the range of 980 to 1000&#xb0; C.

Ceramic sintered body and method for producing ceramic sintered body

A low-temperature sintering ceramic material showing little variation in composition after firing, realizing high bending strength in a sintered body, and capable of forming a reliable ceramic substrate showing high peel strength of a surface electrode includes a main constituent ceramic material containing about 48 weight % to about 75 weight % in terms of SiOof Si, about 20 weight % to about 40 weight % in terms of BaO of Ba, and about 5 weight % to about 20 weight % in terms of AlOof Al, and an accessory constituent ceramic material containing, relative to 100 parts by weight of the main constituent ceramic material, about 2 parts to about 10 parts by weight in terms of MnO of Mn and about 0.1 parts to about 10 parts by weight respectively in terms of TiOand FeOof at least one selected from Ti and Fe, and substantially not includes both Cr oxide and B oxide.

Low-temperature sintering ceramic material and ceramic substrate

To provide a ceramic composition not only having little compositional variation after burning, but a high flexural strength of the sintered body, and a high Q value in a microwave band, a ceramic composition used for forming a ceramic layer of a multi-layer ceramic substrate contains 47.0 to 67.0 wt. % of SiO, 21.0 to 41.0 wt. % of BaO, and 10.0 to 18.0 wt. % of AlO, and contains as a first additive, 1.0 to 5.0 parts by weight of CeO, relative to a total of 100 parts of SiO, BaO and AlO, and as a second additive, 2.5 to 5.5 parts by weight of MnO, relative to a total of 100 parts by weight of SiO, BaO, AlOand CeO, and is substantially free of Cr. As a third additive, at least one of Zr, Ti, Zn, Nb, Mg and Fe, and as a fourth additive, a Co component and/or a V component, may be contained.

Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer

In a sintered body of low temperature cofired ceramic constituting ceramic layers of a multilayer ceramic substrate provided with external conductor films, which is obtained by sintering a non-glass low temperature cofired ceramic material, respective crystalline phases of quartz, alumina, and fresnoite are deposited. The ceramic layers are, because of being in the form of a sintered body of non-glass low temperature cofired ceramic, less likely to fluctuate in composition, and the multilayer ceramic substrate can be thus inexpensively and easily manufactured therefrom. In addition, the ceramic layers have the above-mentioned respective crystalline phases deposited therein, and thus have a high joint strength with the external conductor films, and moreover, the sintered body itself has a high fracture touhgness value.

Growing community of inventors

Nagaokakyo, Japan

Tsuyoshi Katsube