Mitsubishi Electric Corporation

Tsuyoshi Jida

Masaki Kato

Daisuke Nakashima

Takuya Oga

Kazuyasu Sakamoto

Tsuyoshi Sugihara

Gen Tada

A semiconductor device is provided, in which a first lead () is joined with the bottom electrode () of a MOS-FET () with first solder (), the top electrode () of the MOS-FET is joined with an internal lead () with second solder (), the internal lead is joined with a projection () of a second lead with third solder (), and the first lead, second lead, MOS-FET and internal lead are integrally molded using sealing resin (), wherein the first solder and second solder include support members () and (), respectively, located thereinside and positions of the internal lead and MOS-FET are stabilized by self-alignment.

Growing community of inventors

Chiyoda-ku, Japan

Tsuyoshi Jida