Nitto-denko Corporation

Tsuyoshi Ishizaka

Eiji Toyoda

Goji Shiga

Kosuke Morita

Chie Iino

Jun Ishii

Yuki Sugo

Kazuhiro Ikemura

Tsutomu Nishioka

Nao Kamakura

Shinya Akizuki

Keisuke Yoshikawa

Takahiro Uchida

Mitsuaki Fusumada

Takuya Eto

Takeshi Okada

Kei Toyota

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23&#xb0; C. to 400&#xb0; C. in the air at a heating rate of 10&#xb0; C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape

A sealing sheet with separators on both surfaces is provided with a sealing sheet, a separator (A) stacked on one surface of the sealing sheet and having a thickness of 50 &#x3bc;m or more, and a separator (B) stacked on the other surface of the sealing sheet.

Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device

The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150&#xb0; C. for 1 hour is 125&#xb0; C. or higher, and a thermal expansion coefficient &#x3b1; [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E' [GPa] at 25&#xb0; C. of the thermally cured product satisfy the following formula (2):30&#x2266;&#x2266;120 [kJ/mol]&#x2003;&#x2003;(1); and10,000&#x2266;&#x3b1;&#xd7;&#x2032;&#x2266;300,000 [Pa/K]&#x2003;&#x2003;(2).

Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package

A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230&#xb0; C., and then mixing the component (A) and remaining components with the resulting mixture.

Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby

Growing community of inventors

Ibaraki, Japan

Tsuyoshi Ishizaka