Nhk Spring Co., Ltd.

Tsuyoshi Inuma

Hiroshi Nakayama

Yoshio Yamada

Takashi Akao

Shuji Takahashi

Mitsuhiro Nagaya

Kohei Hironaka

Kazuya Soma

Shunsuke Sasaki

Takashi Nidaira

Yuya Hironaka

A probe unit includes: a plurality of first contact probes each coming into contact with an electrode to be contacted on one end side in a longitudinal direction; a second contact probe connected to an external ground; and a probe holder configured to hold the first and second contact probes, the probe holder including a first hollow portion configured to allow the first contact probes to be inserted therethrough and hold the first contact probes, a second hollow portion configured to allow the second contact probe to be inserted therethrough and hold the second contact probe, and a through-hole provided around the first hollow portion, wherein the probe holder includes a conductive portion that constitutes the through-hole and electrically connects the through-hole and the second contact probe.

Contact probe, probe holder and probe unit

A probe unit includes: a first contact probe configured to come in contact with a signal electrode; a second contact probe configured to come in contact with a ground electrode; a probe holder including a first holder hole through which the first contact probe passes, and a second holder hole through which the second contact probe passes; and a conductive floating member including a first through hole to which the first contact probe is inserted and the signal electrode is inserted, and a second through hole to which the second contact probe is inserted and the ground electrode is inserted. The probe holder is configured such that at least an inner circumferential surface of the first holder hole has an insulating property, and the probe unit has a coaxial structure in which central axes of the first contact probe and the first through hole are aligned with each other.

Probe unit

A probe unit includes: first contact probes each coming into contact with a target electrode on one end side in a longitudinal direction; a second contact probe connected to an external ground; a signal pipe disposed around each first contact probes; a ground member provided around each signal pipe and configured to form an air layer with the signal pipe; a probe holder including a plate-shaped first and second members; a first wiring part provided at least on a front surface of the first member and electrically connected to the second contact probe; a second wiring part provided at least on a front surface of the second member and electrically connected to the second contact probe; a first conductive unit configured to electrically connect the first wiring part and the ground member; and a second conductive unit configured to electrically connect the second wiring part and the ground member.

A probe unit includes: a plurality of contact probes each of which has one end that is brought into contact with a contacting electrode, the one end being an end in a longitudinal direction; a first ground member connected to an external ground; a second ground member provided around each of the contact probes; a connecting member electrically connected to the first ground member, and electrically connected to one end of the second ground member; and a probe holder configured to hold the contact probes, the first ground member, the second ground member and the connecting member.

A conductive contactor unit includes: a signal conductive contactor configured to input or output a signal to or from a predetermined circuit structure, the signal conductive contactor including a first plunger, a second plunger, and a spring member; and a conductive contactor holder configured to house the signal conductive contactor used for inputting and outputting the signal to and from the predetermined circuit structure, the conductive contactor holder having a coaxial structure with the signal conductive contactor, and including a holder substrate including an opening configured to allow the signal conductive contactor to be inserted therethrough, a holding member housed in the opening, and including a holding hole configured to hold one or more of the signal conductive contactors, and a stab configured to form a hollow space extending from the holding hole in a direction perpendicular to a central axis of the holding hole.

Conductive contactor unit

A probe card is provided that is capable of accurately ensuring the flatness and the parallelism with respect to a predetermined reference surface. A point (Q) of application of force applied from a leaf spring () that presses a portion near an edge portion of a surface of a probe head () from which a plurality of probes projects over an entire circumference in a direction of a substrate to the probe head () is positioned inside of an outer edge of the probe head (), and a point (P) of application of force applied from the retainer () that presses a portion near an edge portion of a space transformer () over an entire circumference in the direction of the substrate to the space transformer () is positioned inside of an outer edge of the space transformer ().

Probe card for a semiconductor wafer

A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head; and a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer.

Probe card electrically connectable with a semiconductor wafer

A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card () that holds a plurality of probes () for electrically connecting a wafer () as a test object and a circuitry for generating a signal for a test with respect to the wafer (), adjusting screws () as at least part of an inclination changing unit are provided. The inclination changing unit changes a degree of inclination of the probe card () with respect to a mounting reference surface (S) of a prober () for mounting the probe card () thereon.

Parallelism adjusting mechanism of probe card

A probe card includes a flat wiring board having a wiring pattern corresponding to a circuit structure for generating a signal for a test, an interposer that is stacked on the wiring board and relays wirings of the wiring board, a space transformer that is stacked on the interposer and fastened thereto by an adhesive, transforms a space between the wirings relayed by the interposer, and leads the wirings out to a surface opposite a surface facing the interposer, and a probe head that is stacked on the space transformer and houses and holds a plurality of probes.

Growing community of inventors

Nagano, Japan

Tsuyoshi Inuma