Hitachi, Ltd.

Ikegami Tsushinki Co., Ltd.

Nitto-Denko Corporation

Hitachi Construction Machinery Co., Ltd.

Nippon Telegraph and Telephone Public Corporation

Texas Instruments Corporation

Hitachi Maxell, Limited

Hitachi Maxell Engery, Ltd.

Tsuyoshi Inoue

Hiroshi Wada

Taro Iwamoto

Kozo Ono

Naoki Miyanagi

Kojiro Ogata

Hiroshi Tobita

Kiyoshi Tsuchiya

Nobuyuki Tobita

Masao Suda

Osamu Ae

Yoshiyuki Iwai

Shuichi Satoh

Minoru Shiozaki

Manabu Nakano

Kazuo Fujishima

Kazuo Honma

Kohji Kamejima

Masakatsu Fujie

Yoshiyuki Nakano

Toshiharu Konishi

Naoki Matsuoka

Yoshikazu Soeda

Naoyuki Nishiyama

Yasuo Hayakawa

Hironori Tamai

Mitsuru Yoshikawa

Kazuyuki Yagura

Katsumi Miyaki

Ryutaro Arakawa

Sakae Takeda

Yoshitsugu Hasegawa

Takashi Sumida

Akio Anada

Tosio Nonaka

Osamu Akatsuchi

Saiki Hotate

Positive and negative terminals formed on a top face of a unit cell and positive and negative terminals formed on a surface of a circuit board opposed to the unit cell are electrically connected to each other by connectors. The connectors each include an elastic body formed from an elastic material, and a conductor which is placed so as to be exposed on upper and lower surfaces of the elastic body and which serves for electrically connecting those exposed portions to each other. By elastic restoring force of the elastic body generated by elastic compression of the elastic body between the terminals, the upper and lower surfaces of the connectors are put into press contact between the opposing positive and negative terminals of the unit cell and the circuit board, by which their electrical connection is maintained.

Battery pack

The double-sided pressure-sensitive adhesive tape or sheet is a double-sided pressure-sensitive adhesive tape or sheet containing a support having a pressure-sensitive adhesive layer on the both surfaces thereof, characterized in that the double-sided pressure-sensitive adhesive tape or sheet has a total thickness including the thickness of the support and the two pressure-sensitive adhesive layers formed on the both surfaces of the support of 0.003 mm or more and less than 0.03 mm and a breaking strength of from 2 to 26 MPa/10 mm-width. The support preferably has a thickness of from 0.002 to 0.012 mm. As the support, plastic films (especially, a polyethylene terephthalate film) are suitable. The double-sided pressure-sensitive adhesive tape or sheet may have a length of 5 m or more and have a roll-wound form.

Double-sided pressure-sensitive adhesive tape or sheet and process of producing the same

A semiconductor substrate that has a MOS transistor with a high breakdown voltage having double sidewall insulation films and can inhibit negative effects on the electric characteristics and method thereof. The semiconductor device is formed as a transistor with a configuration having gate insulation filmand gate electrodeformed on semiconductor substrate, inner sidewall insulation filmformed at least on part of the gate insulation film and on both sides of the gate electrode, outer sidewall insulation filmformed at least on part of the gate insulation film and on both sides of the inner sidewall insulation film, low concentration impurity areacontaining an impurity at a low concentration and formed in the semiconductor substrate in the area underneath the inner sidewall insulation film and the outer sidewall insulation film, and high concentration impurity areacontaining an impurity at a concentration higher than the low concentration impurity area and formed in the semiconductor substrate in the area underneath both sides of the outer sidewall insulation film.

Semiconductor device and manufacturing method thereof

The present invention provides a resonance circuit tag that comprises an insulating substrate and a resonance circuit formed on the substrate. Additionally, the resonance circuit contains at least a capacitor and an inductor. Further, a dielectric of the capacitor satisfies at least either being foamable by heating or being capable of changing its thickness by not less than 10% by heating. The resonance circuit of the present invention also provides various advantages in that it can easily cease functioning, it does not inhibit labor-saving and speedy operation at the cash register, it facilitates large-scale production, and it eliminates degradation of the function of the article to which the tag has been attached.

Resonance circuit tag, method for production thereof and method for

The present invention relates to an acoustic microscope system having an ultrasonic probe that is driven with a high-frequency burst signal to radiate an ultrasonic signal and that detects the resulting reflected and irradiated waves, a Z-axis moving device that updates the vertical distance Z between the probe and a material of interest for each sampling position, and device for constructing a V(z) curve from the reflection signals obtained at respective sampling positions. The ultrasonic probe of the invention is provided with an acoustic lens, a first ultrasonic transducer for receiving a leaky surface skimming compressional wave reflected from a sample material on one side of the acoustic lens, and a second ultrasonic transducer also provided on the side of the acoustic lens for receiving a leaky surface acoustic wave.

Acoustic microscope system

A vertically arranged plurality of trays are each formed with a cut-out at a rear corner. The trays are arranged so that the corner where the cut-out is formed is lower than the other corners. Vertically upward extending rear and side walls are provided on each tray adjacent the cut-out. A downwardly extending side wall is formed on the tray opposite the upwardly extending one. The trays can be selectively shifted by cylindrical cams to positions wherein sheets of printed matter can be ejected thereonto. Due to the skewed angle of the trays the sheets slide to the corners where the cut-out are formed. After sheet collation a tray drawing device pulls a tray rearwardly to a stapler which fastens the sheets at the corners which extend into the cut-out. The tray drawing device then returns the tray, the trays are shifted vertically by the cylindrical cams, and the next tray is pulled to the stapler.

Sorter

A sorter includes a plurality of vertically movable trays which are each formed with a cut-out in one corner. The trays are supported so that the corners in which the cut-outs are formed are lower than the other corners of the tray. Rear and side walls flank the cut-outs. Due to the skewed angle of the trays sheets which are ejected thereonto slide under their own weight to the corners in which the cut-outs are formed. A tray shift mechanism includes groups of two Geneva wheels each formed with one or more recesses which can pick-up tray pins and guide the same along guide slots. The guide slots are formed with shaped portions which induces one tray at a time to be moved laterally to a position wherein sheet collection or stapling can be carried out. A spring loaded stopper cooperates with each set of two Geneva wheels and holds the pins which have been carried to a laterally displaced position by one wheel, against the periphery of the wheels ready for pick up by the other wheel.

A sorter includes a plurality of vertically movable trays which are each formed with a cut-out in one corner. The trays are each oriented so that a corner in which the cut-out is formed is lower than the other corners of the tray and formed with a rear wall a side wall which flank the cut-out. A tray shift mechanism includes groups of three Geneva wheels. These wheels are each formed with one or more recesses which can pick-up tray pins and guide the same along guide slots. The slots are formed with portions which induce both vertical and lateral displacement of one or more trays at a time. The Geneva wheel/guide slot arrangements move the trays one by one to a position wherein sheet of printed matter can be ejected thereonto and/or the cut-outs are located in the mouth of a stapler. Due to the skewed angle of the trays the ejected sheets slide under their own weight to the corners in which the cut-outs are formed.

An IC card is provided in which an IC chip is packaged in an opening formed in the IC card. One surface of the IC chip is laid on a film substrate on which external contact terminals are formed, and the other surface is covered with a reinforcing plate, the IC chip. The film substrate and the reinforcing plate are formed integrally in a thin plate-like module which is well-fitted in the above-mentioned opening while the external contact terminals on the film substrate are exposed externally.

IC card

A vibration generating apparatus including a support body having a first center axis, a first spherical joint element provided at a forward end of the support body and having the center of a sphere located on the first center axis, a vibrating body having a second center axis passing through the sphere center, a second spherical joint element provided on the vibrating body and concentric complementary with the first spherical joint element to cooperate therewith to allow the vibrating body to be supported on the support member for universal movement, a rotary shaft coaxially rotatably supported within the vibrating body, a pair of eccentric weights mounted on the rotary shaft with a phase deviation of 180 degrees and in a manner symmetrical with respect to the sphere center, and a drive motor connected to the rotary shaft for driving same for rotation whereby the pair of eccentric weights are rotated about the second center axis to cause the vibrating body to move in conical motion vibration such that the second center axis describes a circular cone having a vertex located at the sphere center about the first center axis.

Vibration generating apparatus

A pipe laying apparatus including an excavator propulsion unit located in a starting pit. The excavator includes an excavator body having a first axis, an excavating tool having a second axis and located at a forward end portion of the excavator body, and injection ports formed in the excavating tool for injecting a viscosity imparting liquid into soil as excavated. The excavator body has a rearward portion thereof disposed adjacent pipes to be laid each having an outer diameter smaller than the outer diameter of the excavating tool and positioned at a rearward end thereof against the propulsion means, and is operative to excavate the earth to form a hole therein while the viscosity imparting liquid is being injected through the injection ports into the soil as excavated to thereby produce a viscosity imparting liquid containing soil which is conveyed rearwardly through an outer periphery of the excavator body while being filled in an annular clearance defined between the hole formed in the earth and the pipes to be laid, so that the pipes can be successively laid as the excavator body and the pipes are propelled forwardly by the propulsion unit.

Pipe laying apparatus

A picture processing apparatus for use in recognizing an ambient environment as a picture in accordance with the invention, includes a picture input for receiving a distorted picture of a wide angle of view, a picture processing unit which corrects the distorted picture of the wide angle of view from the picture input into an undistorted picture of the wide angle of view, and a display for displaying the undistorted picture of the wide angle of view produced by the picture processing unit.

Picture processing apparatus

A vehicle has a pair of endless tracks each extending around a series of wheels arranged in a plane adjacent to one side of the vehicle body. One of the series of wheels on each side of the vehicle body is movable relative to the vehicle body to a selected position to vary the configuration of the endless track in side view so that the vehicle is given a superior running performance and is freely movable along paths having various obstacles.

Variable configuration track laying vehicle

Growing community of inventors

Ibaraki, Japan

Tsuyoshi Inoue