Sumitomo Electric Industries, Limited

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

Tsuyoshi Hosokawa

Futoshi Nishida

Shigeki Yamane

Tadashi Tomikawa

Tomoki Kano

It is an object to effectively reduce minute clearances generated between a heat radiating member and a vehicle body and ensure good cooling performance while avoiding the occurrence of impact and noise caused by the vibration of a vehicle. A circuit unit U is mounted such that an outer surfaceB of the heat radiating memberto which the circuit bodyis fixed faces a body surface S of the vehicle with a clearance. Preferably, the mounting partfixed to the body of the vehicle is extended, the surfaceof the mounting partwhich is in contact with the body is positioned to be substantially parallel to the outer surfaceB of the heat radiating member and a step is provided in both surfacesB. In a mounted state, the body and the outer surfaceB of the heat radiating member are facing each other in a substantially parallel state and a clearance is formed between the body and the outer surface of the heat radiating member over the entire area excluding the mounting part

Mounting structure of on-vehicle circuit unit and on-vehicle circuit unit

There is provided a circuit structure in which a control circuit is formed on the upper surface of an insulating plateby control busbars, and a power circuit is formed on the lower surface of the insulating plateby power busbars. By this configuration, the circuit structure can be made small in size as compared with the case where the control circuit and the power circuit are formed on separate circuit boards. Also, the insulating plateis formed with an opening, and a power busbaris positioned over the opening. In the opening, a terminalB of a relayis positioned, and is connected to the power busbar. Thereby, the connecting work process can be simplified as compared with the case where the power circuit and the terminalB of the relayare connected to each other, for example, by a jumper wire.

Circuit structure that connects an electronic part to a conducting path

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Yokkaichi, Japan

Tsuyoshi Hosokawa