Renesas Electronics Corporation

Nec Electronics Corporation

Tsuyoshi Hirakawa

Yuji Tada

Hironori Nakamura

Takayuki Kurokawa

Noriaki Komatsu

Ichiro Mizuguchi

Nobutoshi Tsunesada

Manabu Kitabatake

Kenichi Ushikoshi

Kouji Naganawa

A semiconductor device includes a substrate, a multi-layer wiring layer formed on the substrate, and including a signal line and ground lines extending above the signal line, one of the ground lines extending toward a direction in a layer and another one of the ground lines extending from the one of the ground lines toward another direction in the layer, a first pad on the multi-layer wiring layer, and a redistribution layer formed on the multi-layer wiring layer, including a second pad, a redistribution line coupling the first pad and the second pad, and an insulation film covering the redistribution line.

Semiconductor device

A semiconductor device, includes a substrate, a multi-layer wiring layer formed on the substrate, and including a signal line and ground lines extending above the signal line, one of the ground lines extending toward a direction in a predetermined layer and another one of the ground lines extending from the one of the ground lines toward another direction in the predetermined layer, a first pad on the multi-layer wiring layer, a redistribution layer formed on the multi-layer wiring layer, including a second pad, a redistribution line coupling the first and second pads, and an insulation film covering the redistribution line, the redistribution line extending above the ground lines along the one of the ground lines and not extending along the another one of the ground lines. The insulation film includes a hole exposing the second pad above an end portion of the one of the ground lines.

A semiconductor device includes a substrate over which a circuit is formed, a multi-layer wiring layer having a plurality of wiring layers formed over the substrate and a pad formed in a predetermined location of an uppermost layer of the wiring layers, a new pad provided in an appropriate location over the multi-layer wiring layer, and a redistribution layer provided with a redistribution line coupling the new pad and the pad. In the semiconductor device: the multi-layer wiring layer includes a signal line for transmitting an electric signal to the circuit and a ground line provided in a wiring layer between the redistribution line or the new pad and the circuit; the ground line is formed to correspond to a location where the new pad is assumed to be located and a route along which the redistribution line is assumed to be formed; and the redistribution line is formed along at least a portion of the ground line.

A semiconductor integrated circuit device includes a first chip that is directly accessible from outside, a second chip that transmits and receives data to and from the first chip, the second chip being not directly accessible from outside, and a through circuit that is provided in the first chip and transmits first and second test signals input from an external device to the second chip, wherein the through circuit includes a first signal transmission path to generate a first signal by synchronizing the first test signal to a clock signal input from the external device and to output it to the second chip and a second signal transmission path to generate a second signal by synchronizing the second test signal to a test clock signal input from the external device and to output it to the second chip.

Semiconductor integrated circuit device and method of testing same

A semiconductor integrated circuit device includes a first chip, a second chip to transmit and receive data to and from the first chip, and a through circuit provided in the first chip to transfer a clock signal and a test signal to the second chip. The clock signal and the test signal is inputted from an external device. The through circuit adjusts timing relation between the clock signal and the test signal based on a timing adjust signal. The timing adjust signal is inputted from the external device.

Growing community of inventors

Kanagawa, Japan

Tsuyoshi Hirakawa