Omron Corporation

Omron Healthcare Company Ltd.

The University of Shiga Prefecture

The Ritsumeikan Trust

Tsuyoshi Hamaguchi

Masao Shimizu

Minoru Taniguchi

Shinya Nakagawa

Chisato Tawara

Yuki Nakagawa

Yasutaka Nishioka

Takashi Fuchimoto

Tomofumi Maekawa

Naoto Kuratani

Katsunori Kondo

Sadao Kawamura

Takuya Katagiri

Yuki Sugano

Kenta Azuma

Wataru Masuda

Hye Jong Kim

Iwanori Namba

A cuff unit of the present invention includes a first wall and a second wall that face each other with an object which has a rod shape interposed therebetween, an actuator that is capable of moving the first wall and the second wall in parallel with each other in a direction in which the first wall and the second wall relatively approach each other or separate from each other, a pressing fluid bag that is provided on a surface of the first wall on a side facing the object and that receives supply of a fluid from outside to inflate and press the object, and a restraining fluid bag that is provided on a surface of the second wall on a side facing the object and that receives supply of a fluid from outside to inflate along the periphery of the object.

Cuff unit and sphygmomanometer

Provided is a sensor module, a method for manufacturing a sensor module, and a blood pressure measurement device that can improve the holding force onto a soft portion. A sensor moduleof a blood pressure measurement deviceincludes: a sensor base; a pressure sensor portionfixed to the sensor base; a sensor head coverincluding, on an outer surface, an openingin a region that comes into contact with a wristand an inner surfaceformed with unevenness, the sensor head coverbeing fixed to the sensor baseand forming a gap portionthat communicates with the openingbetween the inner surface, the sensor base, and the pressure sensor portion; and a soft portiondisposed in the gap portionand, at least, filling up the openingand covering the pressure sensor portion

Sensor module, method for manufacturing sensor module, and blood pressure measurement device

Provided is a sensor module, a method for manufacturing a sensor module, and a blood pressure measurement device with a highly smooth surface and high sensor accuracy. A sensor moduleincludes: a pressure sensor portion; a sensor baseincluding a support wall portionwith flow holestoformed extending through the support wall portionfrom one main surface side to the other main surface side, the pressure sensor portionbeing disposed on the one main surface side of the sensor base; a sensor head coverincluding an openingat a position opposite a sensorand disposed on the one main surface side of the support wall portionof the sensor basewith a gapthat communicates with the flow holestoand the openingformed therebetween; and a soft portiondisposed in the openingthat covers the pressure sensor portion

A soft gripper that surrounds and grips an outer peripheral surface of an object, the soft gripper includes an elongated first actuator and an elongated second actuator, which are deformed in response to supply of a fluid. The first actuator and the second actuator extend from bases of the first and second actuators toward opposite sides each other. When receiving the supply of the fluid, each of the first and second actuators sequentially surrounds the object from the base toward a side of a leading end of the each of the first and second actuators.

Soft gripper and blood pressure measuring cuff comprising the same

A force detector includes a support, fluid bags, a contact portion, a detector, and a computer. The contact portion is opposite to a side on which the fluid bags are in contact with the support and is adjacent to the fluid bags. The computer obtains information regarding the internal pressures of the fluid bags from the detector. Upon application of an external force to the contact portion from an object, the computer calculates a force acting in a tangential direction on a contact surface between the object and the contact portion based on a difference between the internal pressures of the fluid bags.

Force detector

Provided is an internal temperature measurement device capable of measuring an internal temperature of a measuring object for which the thermal resistance value of a non-heating body present on the surface side of the object is unknown, more accurately with better responsiveness than hitherto. The internal temperature measurement deviceincludes a MEMS chipincluding: two cellsfor measuring two heat fluxes for calculating an internal temperature of a measuring object for which the thermal resistance value of a non-heating body is unknown; and a cellfor increasing a difference between the heat fluxes.

Internal temperature measurement device

A method includes measuring a first temperature difference between first heat entry and discharge parts on a first heat transfer path extending from a portion of a surface of the object to the first heat discharge part using a first thermopile, and measuring a second temperature difference between a second heat entry and discharge parts on a second heat transfer path extending from another portion of the surface of the object to the second heat discharge part using a second thermopile, and measuring a reference temperature at a predetermined position on the first or second heat transfer path using a temperature sensor, and calculating the internal temperature of the object using the measured first and second temperature differences, and the reference temperature, and at least one predetermined value excluding a physical property value of a non-heating part of the object located at a surface side of the object.

Internal temperature measurement method and internal temperature measurement device

An internal temperature sensor includes substrates with one surface to be placed in contact with a measurement surface of an object to measure an internal temperature of the object, a heat flux sensor on another surface of the substrates, and a temperature sensor. The heat flux sensor is fabricated through a MEMS process and includes first and second temperature measurement parts, and a thin film including a thermopile to detect a temperature difference between the first and second temperature measurement parts. The thin film is supported by a thermally conductive member to form a space between the first temperature measurement part and the substrates and to extend parallel to the substrates. The thermally conductive member conducts heat traveling from the object through the substrates to the second temperature measurement part. The temperature sensor measures the temperature of a part of the substrates that is in contact with the thermally conductive member.

MEMS internal temperature sensor having thin film thermopile

A miniaturized microphone maintaining the properties of a microphone chip and achieving a smaller mounting area. The microphone includes a package which includes a first and second member. At least one of the first second members includes a recess. The microphone also includes a circuit element installed on an inner surface of the first member. Additionally, the microphone includes a microphone chip arranged on a surface on an opposite side of an installing surface of the circuit element.

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Kyoto, Japan

Tsuyoshi Hamaguchi