Sumitomo Electric Industries, Limited

Other

Tsuyoshi Haga

Yoshihiro Hirata

Yasuhiro Okuda

Jun Yorita

Taro Fujita

Fumihiro Hayashi

Kazunori Okada

Yasuhito Masuda

Katsuya Okumura

Nobuo Hayasaka

Hideki Shibata

Noriaki Matsunaga

Kazuo Nakamae

Atsushi Kimura

Shigeki Shimada

Toshiyuki Numazawa

Mayo Uenoyama

Yuichi Idomoto

Yasuhito c/o Osaka Works Masuda

Yasuhiro c/o Osaka Works Okuda

Fumihiro c/o Osaka Works Hayashi

A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.

Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.

The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film () that is made of synthetic resin and that has electrically insulating property. The porous film () is provided with a plurality of holes () that are formed in the direction of thickness so that pin electrodes () can be through-hole-mounted. The inner walls of the holes () are coated with metals (). The inserted pin electrodes () become electrically continuous, through the metals (), with the surface opposite to the surface from which the pin electrodes () are inserted. It is desirable that a porous film have, at the side from which the electrodes are through-hole-mounted, a nonporous film that is made of synthetic resin and that has electrically insulating property and the nonporous film be provided with a plurality of holes that are formed in the direction of thickness so that the pin electrodes can be through-hole-mounted.

Anisotropic conductive sheet, production method thereof, connection method and inspection method

The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.

Anisotropic electrically conductive film and method of producing the same

A micro terminal for inspection or installation with high connection reliability is provided at lower cost. A micro terminal according to the present invention has electrical conduction between the micro terminal and an electrode of an electronic device or an inspection device and includes a columnar contactor in contact with the electrode. The contactor has a spring structure which is elastically deformed when pressed against the electrode. The contactor includes a protrusion protruding outwardly at its end in contact with the electrode and the shape of the protrusion has a part of a sphere or a part of a paraboloid of revolution.

Fine terminal, its manufacturing method, and contact sheet

A method of manufacturing a metal microstructure () by using a resin mold (). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold () can be set and the high-precision metal microstructure () can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure () according to the present invention includes the steps of: fixing on a conductive substrate () the resin mold () having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer () having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure () having the resin mold (); exposing the layered structure () having the resin mold () to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer () existing at the vacant portion of the resin mold (); and filling with a metal () the vacant portion of the layered structure () having the resin mold () by electroforming.

Method for manufacturing metal microstructure

A method of manufacturing a protruding-volute contact for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a layer consisting of metallic material on the plastic mold (resist structure) by means of electroforming; and performing convex formation of a metal microstructure made from the layer consisting of metallic material so as to form a spiral spring that protrudes volutedly outward. With such method, an inspection contact or coupling contact having high reliability and capable of attaining electrical continuity of large electric current can be produced at low cost.

Method of manufacturing protruding-volute contact

A contact probe is fabricated by forming a resin mold with a cavity on a substrate having conductivity, and filling the cavity with metal through electroforming. The metal includes a cobalt-tungsten alloy. Alternatively, a cobalt-molybdenum alloy may be used instead of the cobalt-tungsten alloy. Alternatively, a contact probe can be made from nickel, cobalt or copper, and have a coat film of cobalt-tungsten alloy or cobalt-molybdenum alloy formed thereon to increase the abrasion resistance. A nickel-molybdenum alloy can be used instead of the cobalt-tungsten alloy or cobalt-molybdenum alloy.

Contact probe

An object of the present invention is to provide an electrode for high-density connection capable of attachment/detachment of a package or an FPC. In order to attain this object, a snap electrode according to the present invention has a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in the ring and coupled to the ring, to be connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the spring electrode. The snap electrode preferably consists of nickel or a nickel alloy or consists of copper or a copper alloy, and is preferably coated with a noble metal or conductive diamondlike carbon.

Snap electrode, its bonding method and using method

A method of manufacturing a contact probe includes an electroforming step of, using a resist film () arranged on a substrate () as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film () to form a metal layer (), a tip end shaping step of obliquely removing and sharpening that part of the metal layer () which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer () from the pattern frame.

Contact probe, method of manufacturing the contact probe, and device and method for inspection

A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.

A contact probe comprises a tip portion for making contact with a subject surface, a supporting portion, and a spring portion for connecting the other two members. The tip portion has a corner portion whose radius of curvature is larger than that of the opposite corner portion that moves in the lead during the scrubbing by the pressing force. The insulating layer on the subject surface is sufficiently removed by the scrubbing to secure the electrical contact, and the amount of shavings is minimized during the dissociation of the contact probe. Formation of scratches on the subject surface is reduced. Another contact probe for a ball-shaped electrode has a tip portion with a recess, which has a protrusion and bottom. The protrusion breaks the insulating layer on the electrode to secure the electrical contact. The bottom makes contact with the electrode to prevent the protrusion from excessively biting the electrode.

A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit to form contact with a circuit to be tested, a spring unit, and a lead wire connection unit, all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit parallel to the spring unit is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper for each unitary configuration of the spring unit constituted by a leaf spring.

Contact probe with guide unit and fabrication method thereof

A microconnector provides a practically sufficient strength, and has an arrangement in which structures of electrode members and guiding members can be designed at least somewhat independently of each other for allowing a simple connecting operation. In a male connector, wiring layers are formed on a substrate, and male pin connector electrodes project from the wiring layers, whereby the electrodes are two-dimensionally arranged and enclosed with spacers. In a female connector, on the other hand, wiring layers are formed on a substrate, and female connector electrodes are formed on single ends of the wiring layers respectively. The female connector electrodes comprise holes for receiving the pin electrodes, and are arranged in correspondence to the pin electrodes. The female connector electrodes each having a spring characteristic and are enclosed with spacers. The male and female connectors are electrically connected with each other by superposing the substrates with each other while orienting electrode surfaces thereof to be opposed to each other. The pin electrodes and the female connector electrodes are naturally aligned and brought into engagement with each other due to attraction of magnetic layers formed on the male and female connectors respectively.

Growing community of inventors

Hyogo, Japan

Tsuyoshi Haga