Adv Antest Corporation

Tsuyoshi Ataka

Atsushi Ono

Shoji Kojima

Shin Masuda

Hideo Hara

A probe includes a transmission line support substrate, a probe tip and a probe tip support substrate. The transmission line support substrate supports a transmission line through which a terahertz wave is transmitted. The probe tip transmits the terahertz wave, and is contact with an object to be measured. The probe tip support substrate supports the probe tip. The probe tip support substrate is detachable from the transmission line support substrate.

Measuring probe using terahertz wave

Provided is a test apparatus including an optical test signal generating section that generates an optical test signal; an optical signal supplying section that supplies the optical test signal to a device under test that is a testing target among a plurality of the devices under test; a first optical switch section that selects, from among optical signals output by the plurality of devices under test, the optical signal output by the device under test that is the testing target; and an optical signal receiving section that receives the selected optical signal.

Test apparatus, test method, calibration device, and calibration method

Provided are a first test substrate and a second test substrate opposing each other, a first test circuit testing a device under test and being disposed on a face of the first test substrate that faces the second test substrate, a second test circuit testing the device under test and being disposed on a face of the second test substrate that faces the first test substrate, and a sealing section that is formed by sealing a space between the first test substrate and the second test substrate to enclose the first test circuit and the second test circuit in a common space that is filled with coolant.

Test apparatus and circuit module

An apparatus comprising a test circuit that is provided on a test substrate and tests the device under test; a sealing section that covers a region of the test substrate on which the test circuit is formed, and seals the test circuit to form a sealed space that is filled with a cooling agent; and a through-connector that passes through the sealing section and electrically connects the test circuit to an element provided outside the sealing section, such that the connection is not through the test substrate.

Growing community of inventors

Gunma, Japan

Tsuyoshi Ataka