Shin-etsu Chemical Co., Ltd.

Sony Corporation

Other

Takata Corporation

Tsutomu Yoneyama

Kazuhiko Tomaru

Ryuichi Handa

Kunihiko Mita

Hisaharu Yamaguchi

Takashi Setsuda

Yoshitaka Aoki

Hirokazu Kanno

Kenji Nakamura

Kunihiro Yamada

Akio Nakano

Akio Suzuki

Nobumasa Tomizawa

Hiroaki Tetsuka

Shuichiro Miyata

Toru Takamura

Masaki Fukuda

Masakatsu Hotta

Ryuichi Miura

An airbag device including an inflator, an airbag and a silicone rubber sheet. The silicone rubber sheet is used for a flow passage to feed gas from an inflator to an airbag and is produced by stacking 0.5 mm or more of silicone composition comprising: 100 parts by weight of organopolysiloxane which is represented by the following average composition formula RSiO, where in the formula, Rrepresents a substituted or unsubstituted monovalent hydrocarbon group and n represents a positive number of 1.95 to 2.05, and which exhibits an average degree of polymerization of 1,000 or more; 20 to 80 parts by weight of reinforcing silica powder having a specific surface area of 50 m/g or more; and a curing agent on at least an inner surface of a fiber fabric constituting the flow passage and performing heat curing.

Silicone rubber sheet and airbag device

A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.

Heat conductive composite sheet and process for producing same

A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.

Radiating structural body of electronic part and radiating sheet used for the radiating structural body

A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &#x3bc;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &#x3bc;m. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250&#xb0; C. and a particle diameter of 0.1-100 &#x3bc;m, together with a thermally-conducting powder (2) having a melting temperature exceeding 250&#xb0; C. and an average particle diameter of 0.1-100 &#x3bc;m, such that (1)/[(1)+(2)]=0.2-1.0.

Heat-dissipating member, manufacturing method and installation method

A heat-softening heat-radiation sheet including a polyolefin-based heat-conductive composition which comprises a polyolefin and a heat-conductive filler, has a softening point of 40&#xb0; C. or above, has a thermal conductivity of 1.0 W/mK or higher, has a viscosity at 80&#xb0; C. of from 1&#xd7;10to 1&#xd7;10Pa&#xb7;s and has a plasticity at 25&#xb0; C. in the range of from 100 to 700. This heat-radiation sheet which is in the form of a solid sheet at room temperature, can readily be attached to or detached from electronic components and a heat sink, is capable of softening by the heat generated during operation of electronic components, to have the interfacial contact thermal resistance at a negligible level, and has a superior heat-radiation performance.

Heat-softening heat-radiation sheet

A wafer chuck used in manufacturing processes of integrated semiconductors and liquid crystal panels, more particularly, an electrostatic silicone rubber chuck for ion injectors used in an ion injection process.

Electrostatic chuck for ion injector

A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.

Heat dissipating structure

A dustproof covering film-attached wafer support comprising a base, a silicone rubber layer substantially uniform in thickness and integrated with the base and a dustproof covering film, with the dustproof covering film is attached to the silicone rubber layer in a state that the peel strength between the dustproof covering film and the silicone rubber layer is from 5 to 500 g/25 mm, thereby enabling the covering film to be peeled apart as the need arises; and a production method for such a wafer support.

Wafer support having a dustproof covering film

Wafer holders disposed in the target chamber of an ion implantation apparatus, with each of the wafer holders comprising a wafer mount and an electrically conductive elastic body that is laid on the wafer mount and has a surface for holding a wafer thereon.

Wafer holder of ion implantation apparatus

A method of insulating a cathode ray tube and an electrical insulator composition for a cathode ray tube enabling an electrical insulator to be produced without material loss and enabling improvement of the bonding strength between a stem and a stem base and the insulation property between stem pins, when attaching to a stem, which is provided at the cathode ray tube and has a tip and stem pins projecting therefrom, an insulating stem base, which comprises a base through which pin through holes are formed and has provided projecting from the front surface thereof a tip holder, in a state with the stem pins inserted through the pin through holes and the tip held in the tip holder, said method comprising the steps of molding an electrical insulator composition comprising an uncured self-adhesive silicone rubber into a predetermined sheet shape by using a transfer mold to obtain an electrical insulator, arranging the electrical insulator in a state extending from the positions of the pin through holes on the back of the base of the stem base to the tip holder and adhering it to the back of the base, folding the portion of the electrical insulator extending to the tip holder to the inside surface of the tip holder, and attaching the stem base to the stem.

Method of insulating stem pins of a cathode ray tube

A method of insulating a cathode ray tube and enabling an electrical insulator to be produced without material loss and enabling improvement of the bonding strength between a stem and a stem base, which comprises a base through which pin through holes are formed and has provided projecting from the front surface thereof a tip holder, in a state with the stem pins inserted through the pin through holes and the tip held in the tip holder, said method comprising the steps of molding an electrical insulator composition comprising an uncured self-adhesive silicone rubber into a predetermined sheet shape by using a transfer mold to obtain an electrical insulator, arranging the electrical insulator in a state extending from the positions of the pin through holes on the back of the base of the stem base to the tip holder and adhering it to the back of the base, folding the portion of the electrical insulator extending to the tip holder to the inside surface of the tip holder, and attaching the stem base to the stem.

Method of insulating stem pins of a cathrode ray tube

An electrostatic chuck comprises a metallic plate, a first insulating layer formed on the metallic plate and composed of a ceramic material, an electrically conductive electrode pattern formed on the first insulating layer, and a second insulating layer formed on the conductive electrode pattern and made of an elastomer. Alternatively, the first and second insulating layers may be each made of a thermally conductive silicone rubber provided that the thermally conductive silicone rubber for the second insulating layer should have a hardness of 85 or below a surface roughness of 5 .mu.m or below.

Electrostatic chuck

A silicone rubber composition having thermal conductivity higher than 5.times.10.sup.-3 cal/cm.multidot.sec.multidot..degree.C. and excellent workability in various molding processes, which comprises A) 95-50 parts by weight of an organopolysiloxane having an average polymerization degree of 6,000-12,000, B) 5-50 parts by weight of an organopolysiloxane having an average polymerization degree of 200-2,000, C) 500-1,200 parts by weight of a spherical aluminum oxide powder and D) a curing agent ample for curing the composition consisting of A) to C) .

Thermally conductive silicone rubber composition containing organo

An impasto pattern representing a desired character or mark is formed on a stretchable support, typically sportswear fabric by extruding a high viscosity liquid silicone rubber composition to the support through a nozzle of a robotic applicator having a picture drawing function to form a predetermined pattern of impasto extrudate on the support, and curing the extrudate.

Growing community of inventors

Gunma-ken, Japan

Tsutomu Yoneyama