Hitachi, Ltd.

Tsutomu Shibuya

Hideaki Sasaki

Shinichi Kazui

Yasuhiro Iwata

Kaoru Katayama

Mitugu Shirai

Shigeru Fujimori

Toshiaki Seshimo

Mitsuhiro Ota

The work movement analysis method for dividing a moving picture of a worker's work movement into a plurality of movement sections in an apparatus having display, storage, and processing units includes in the processing unit the steps of: defining a plurality of movement section classification buttons and providing the buttons to an operator; reproducing the moving picture in the display unit; allocating movement section identification information defined by a specific movement section classification button to a moving picture of a work; storing a position of a moving picture in the storage unit as an end position of a movement section; defining an end position of a previous movement section as a start position of the movement section and a reproduction start position of a moving picture of the work movement as the start position in a case of no end position, and dividing the work movement into the movement sections.

Work movement analysis method, work movement analysis apparatus, and work movement analysis program

There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

Surface reformation method of high polymer material

A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

Laser assisted surface reformation method of high polymer material

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Hadano, Japan

Tsutomu Shibuya