Average Co-Inventor Count = 2.70
ph-index = 12
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Ricoh Company, Ltd. (23 from 28,544 patents)
2. Fujifilm Corporation (18 from 16,042 patents)
3. Nippon Steel Corporation (8 from 3,542 patents)
4. Mitsubishi Denki Kabushiki Kaisha (4 from 21,351 patents)
5. Research Laboratories of Australia Pty Ltd. (3 from 19 patents)
6. Canon Kabushiki Kaisha (2 from 90,594 patents)
7. Fujitsu Corporation (2 from 39,228 patents)
8. Nec Corporation (2 from 35,658 patents)
9. Nippon Micrometal Corporation (2 from 61 patents)
10. Nippon Steel & Sumikin Materials Co., Ltd. (2 from 42 patents)
11. Fuji Photo Film Company, Limited (1 from 16,458 patents)
12. Kikkoman Corporation (1 from 235 patents)
66 patents:
1. 11133382 - Semiconductor nanoparticle, semiconductor nanoparticle-containing dispersion liquid, and film
2. 11015117 - Semiconductor nanoparticle-containing dispersion liquid and film
3. 10640703 - Semiconductor nanoparticle, dispersion liquid, film, and method of producing semiconductor nanoparticle
4. 10519369 - Core shell particles, method for producing core shell particles, and film
5. 10465111 - Core shell particle, method of producing core shell particle, and film
6. 10050191 - Oxide particles, piezoelectric element, and method for producing oxide particles
7. 9588487 - Image forming apparatus
8. 9413916 - Image forming apparatus
9. 8998379 - Image forming apparatus
10. 8771541 - Polymer composite piezoelectric body and manufacturing method for the same
11. 8597536 - Perovskite oxide, oxide composition, oxide body, piezoelectric device, and liquid discharge apparatus
12. 8597537 - Perovskite oxide, oxide composition, oxide body, piezoelectric device, and liquid discharge apparatus
13. 8562906 - Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
14. 8501088 - Solder alloy, solder ball and electronic member having solder bump
15. 8434856 - Perovskite oxide, process for producing the perovskite oxide, piezoelectric body, piezoelectric device, and liquid discharge device