Hitachi-high-technologies Corporation

Bs Co., Ltd.

The Furukawa Electric Co., Ltd.

Hitachi High-tech Corporation

Tsutomu Saito

Yasuhiko Nara

Tohru Ando

Tomoharu Obuki

Shinichi Kato

Yasuhiro Mitsui

Hiroshi Toyama

Masahiro Sasajima

Takeshi Sunaoshi

Masaaki Komori

Munetoshi Fukui

Katsuo Ooki

Mikio Takagi

Koichi Takauchi

Mitsugu Sato

Mitsuhiro Nakamura

Isao Takahashi

Natsuki Tsuno

Yohei Nakamura

Eiichi Hazaki

Osamu Yamada

Takashi Miyoshi

Isamu Sekihara

Kunji Shigeto

Yoshihiro Takahoko

Hirofumi Sato

Shigeru Izawa

Katsunori Nakajima

Yoshikazu Inada

Masanori Gunji

Hironori Itabashi

Hirofumi Satou

Kohtaro Hosoya

Kazushige Saito

Kazuyuki Takeda

Yoshinori Numata

Ryohko Saito

In order to provide a charged particle beam apparatus capable of stably detecting secondary particles and electromagnetic waves even for a non-conductive sample under high vacuum environment and enabling excellent observation and analysis, the charged particle beam apparatus includes a charged particle gun (), scanning deflectors (and) configured to scan a charged particle beam () emitted from the charged particle gun () onto a sample (), detectors (and) configured to detect a scanning control voltage input from an outside into the scanning deflectors, an arithmetic unit () configured to calculate, based on the detected scanning control voltage, irradiation pixel coordinates for the charged particle beam; and an irradiation controller () configured to control irradiation of the sample with the charged particle beam according to the irradiation pixel coordinates.

Charged particle beam apparatus

The present invention relates to enabling a versatile charged particle beam device, which is used for a wide range of kinds of samples to be observed and has parameters of emission conditions of a primary charged particle beam that is difficult to be registered in advance, to be operated easily and accurately even by a less-experienced operator and to obtain high-resolution images. A charged particle beam device according to the present invention includes, for example: a charged particle source, a focusing lens for a primary charged particle beam emitted from the charged particle source, an objective lens for focusing the primary charged particle beam, a movable objective aperture having multiple objective apertures disposed on a side of the charged particle source with respect to the objective lens, a detector of a secondary signal from the sample resulting from emission of the primary charged particle beam, a display unit configured to process and display a detected secondary signal, and a storage unit configured to store multiple emission conditions of the primary particle beam. The operation controller makes one emission condition be selected, determines whether or not the objective aperture is suitable for the selected emission condition, displays that the objective aperture is unsuitable when the objective aperture is unsuitable, and preadjusts the primary charged particle beam according to the selected emission condition and stores the preadjustment result as parameters for the emission conditions when the objective aperture is suitable.

Method for adjusting charged particle beam device and adjusting beam aperture based on a selected emission condition and charged particle beam device for same

To provide a sheet former capable of suitably regulating the thickness of a sheet forming body in a width direction in response to factors changing with time. A sheet former includes at least one vessel which stores slurry as a raw material, a wire cylinder immersed in the slurry inside the vessel and making sheets from solid components in the slurry while being rotated, and a sheet-forming amount regulator which regulates an amount of the solid components for making sheets by the wire cylinder in a width direction in accordance with a thickness of a sheet forming body in the approximately width direction formed for making sheets by the wire cylinder.

Sheet former

A charged particle beam device allowing an analysis position in a sample analyzable with an EBSD detector to be acquired beforehand, and allowing a sample to be adjusted to a desired analysis position in a short time. A charged particle beam device is provided with a charged particle source (), a charged particle optical system (), an EBSD detector (), a sample stage (), an image display unit () for displaying a portion of the sample observable with the EBSD detector and a non-observable portion of the sample such that said portions are distinguished from each other, an operation input unit () where a position to be observed by the EBSD detector is entered, and a control unit () for controlling a planar movement, an inclination movement and a rotation movement of the sample stage so as to allow the observation position entered from the operation input unit to be observed with the EBSD detector.

Charged particle beam device enabling facilitated EBSD detector analysis of desired position and control method thereof

A navigation system for easily determining defective positions is provided. In the case of CAD navigation to defective positions, logical information for indicating defective positions is created in a CAD format, instead of CAD data of physical information indicating circuit design. Specifically, by attaching marks such as rectangles, characters, or lines, to an electron microscope image with software, quick navigation is performed with required minimum information. By using created CAD data, re-navigation with the same equipment and CAD navigation to heterogeneous equipment are performed.

Logical CAD navigation for device characteristics evaluation system

An object of the present invention is to obtain a clear absorbed current image without involving the difference in gain of amplifier between inputs, from absorbed currents detected by using a plurality of probes and to improve measurement efficiency. In the present invention, a plurality of probes are brought in contact with a specimen. While irradiating the specimen with an electron beam, currents flowing in the probes are measured. Signals from at least two probes are input to a differential amplifier. An output of the differential amplifier is amplified. On the basis of the amplified output and scanning information of the electron beam, an absorbed current image is generated. According to the invention, a clear absorbed current image can be obtained without involving the difference in gain of amplifier between inputs. Thus, measurement efficiency in a failure analysis of a semiconductor device can be improved.

Specimen inspection equipment and how to make the electron beam absorbed current images

[Problem] It provides a sheet forming machine which can make the thickness in the width direction of a sheet forming body be uniform, and also can obtain a sheet forming body which is integrated in stripe shapes by using different raw materials or raw materials of different colors in the width direction of one sheet forming body. [Solution Means] A sheet forming machine for making a sheet forming body by dehydrating a raw material slurry supplied from a raw material supply tank while transporting the raw material slurry by a sheet forming belt, characterized in that the sheet forming belt has a sheet forming zone with ascending inclination, which is configured to be able to transport the raw material slurry while storing the raw material slurry, partition plates each having a shape extending in the transport direction of the raw material from a beginning end of the sheet forming zone are provided above the sheet forming belt at the sheet forming zone so as to partition the sheet forming zone in the width direction, and the length in the extending direction of the partition plate is equal to or greater than &#x2159; of the width of the sheet forming belt.

Sheet forming machine

A semiconductor testing method capable of quickly counting semiconductor cells in which a seemingly horizontal or vertical line is drawn with a mouse, and raster rotation is performed in alignment with the closer axis. After that, the stage is horizontally moved, pattern matching is performed on an image on a position where the image should be disposed, and an angle is adjusted. The stage is moved evenly along the X-axis and the Y-axis, achieving a movement to a destination like a straight line. In synchronization with the smooth movement of the stage, a cell is surrounded in a rectangular frame by a ruler, and the number of cells is displayed with a numeric value.

Semiconductor testing method and semiconductor tester

A sample inspection apparatus in which a fault in a semiconductor sample can be measured and analyzed efficiently. A plurality of probes are brought into contact with the sample. The sample is irradiated with an electron beam while a current flowing through the probes is measured. Signals from at least two probes are supplied to an image processing unit so as to form an absorbed electron current image. A difference between images obtained in accordance with a temperature change of the sample is obtained. A faulty point is identified from the difference between the images.

Sample inspection apparatus

A probe storage container can supply a probe in a prober apparatus without being exposed to an atmospheric air. Preferably, the probe is stored in the probe storage container by removing an oxide film in a leading end portion of the probe in accordance with a dry treatment using an ion source, for example, without being exposed to the atmospheric air. It is thus possible to replace and attach the probe with respect to the prober apparatus without being exposed to the atmospheric air, avoiding formation of an oxide film on a surface of the probe. Further, a worker attaching the probe to the prober apparatus can work without being directly in contact with the probe, and it is possible to prevent the leading end portion of the probe from being broken. Accordingly, it is possible to stably measure an electric characteristic of a semiconductor device or the like on the wafer.

Probe storage container, prober apparatus, probe arranging method and manufacturing method of probe storage container

A copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate, which copper alloy is a Cu&#x2014;Zn&#x2014;Mg alloy, a Cu&#x2014;Sn alloy, a Cu&#x2014;SN&#x2014;Ag alloy, a Cu&#x2014;Fe&#x2014;Zn&#x2014;P alloy, or a Cu&#x2014;Cr alloy, each having a given alloy composition, in which the copper alloy has conductivity of 50% IACS or more and tensile stress of 400 MPa to 650 MPa.

Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate

Specimen inspection equipment and how to make electron beam absorbed current images

A defect inspecting apparatus in which a plurality of probes to measure electric characteristics of a sample including a fine wiring pattern are combined with a charged-particle beam unit includes graphic user interfaces (GUI) to simply control the plural probes. The apparatus includes a probe image processing unit to display the plural probes on a display; a selecting unit to select, from the probes displayed on the display, a probe to be operated; and a display unit to simultaneously display the probe selecting unit and information indicating that the selected probe is an operable probe, or the probe is in a non-selected state.

Defect inspecting apparatus

Growing community of inventors

Hitachinaka, Japan

Tsutomu Saito