Seiko Epson Corporation

Tsutomu Ota

Masami Murai

Jun Amako

Tomio Sonehara

Fumiaki Matsushima

Akira Makabe

Mamoru Sugimoto

Takashi Hayashi

Yasuto Nose

Hidetoshi Yoshitaki

Tatsuro Higashi

Kazunori Sakurai

A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

The invention provides a method for readily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening in an insulating film which exposes at least a part of a pad, and forming the bump so as to be connected to the pad. A resist layer defines a through hole which extends over at least a part of the pad in plan view. A metal layer is formed in the opening so as to connect to the exposed portion of the pad.

Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device

A laser machining method and apparatus performs high-speed and high-precision machining on a thin film and a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators, drivers for alternately driving a plurality of pulse laser generators to generate laser beams delayed in phase between each other; collimators for making the generated laser beams equal in quality; a wave plate for converting the laser beams into elliptically polarized laser beams; and a phase grating for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; such that an object to be processed is selectively illuminated with the plurality of laser beams produced by the phase grating. The phase grating has structure on its surface for dividing each of the laser beams into equal intensity beams. Open grooves are formed having uniform shape and quality.

Laser machining method for precision machining

A laser machining apparatus for performing high-precision machining on a thin film deposited on a substrate, such as a liquid crystal panel. The apparatus includes a pulse laser generator for emitting a laser beam, a driver for driving the pulse laser generator, a phase grating for dividing the laser beam; a rotary stage for rotating the phase grating to control the direction of the beams illuminating an object, and a spatial filter (element 2101).

Laser machining apparatus with a rotatable phase grating

A laser machining method and apparatus for performing high-speed and high-precision machining on a thin film deposited on a substrate, as well as a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators; a system for alternately driving a plurality of pulse laser generators so that the plurality of pulse laser generators generate laser beams having a delay in phase between each other; a system for making the laser beams generated by the plurality of laser beam generators equal in quality; a system for converting the laser beams generated by the plurality of laser beam generators into elliptically polarized laser beams; and a system for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; whereby an object to be processed is selectively illuminated with the plurality of laser beams produced by the beam-dividing system. The system for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams is embodied by a phase grating. The phase grating has a structure on its surface which divides each laser beam into a sub plurality of laser beams having equal intensity, from which open grooves having a uniform shape and uniform quality can be formed. The liquid crystal panel includes an electrode structure in which open grooves are formed on an ITO film by using the apparatus. Open grooves (electrode gaps) having a constant width less than 10 .mu.m are uniformly formed in a display area at constant intervals. Thus, the liquid crystal panel according to the present invention provides a much greater contrast ratio and much better visibility performance than conventional techniques, wherein these are primary factors which doming the display quality.

Laser machining apparatus with rotatable phase grating

An information recording disk formed from two substrates with a stepped central opening for receiving a hub within the stepped recess of at least one of the substrates is provided. In one embodiment, the central aperture of the first substrate is larger than the central aperture of the second substrate to form the stepped recess. In another embodiment, at least one substrate has a stepped surface defining a central aperture and a hub structure is mounted within this stepped recess to reduce overall thickness of the disk.

Growing community of inventors

Chino, Japan

Tsutomu Ota