Denso Corporation

Nippondenso Co., Ltd.

Tsutomu Onoue

Hiroshi Koyama

Izuru Shoji

Keigo Asano

Tadatsugu Nakamura

Masaaki Tanaka

Hiroaki Mizuno

Hisashi Kayano

Hidehisa Nasu

Shusaku Nakazawa

Manabu Ishiguro

Takehiro Sengoku

Yuji Ozaka

Mitsumasa Seko

A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the radiator plate and at least a part of the side surface adjoining the outer main surface are exposed from the molded resin.

Semiconductor device, method and apparatus for fabricating the same

A method of manufacturing a sensor device includes a step of forming a sensor chip including a sensing element and a wiring portion connected to the sensing element on a substrate, a step of connecting the wiring portion to a lead, and a step of molding a member for covering a connecting portion between the wiring portion and the lead by injecting a molding material in a mold, while the sensing element is exposed. In the molding step, a buffering member is disposed between an area to be covered with the molded member and the sensing element. Furthermore, in the molding step, the buffering member is deformed by a pressure from the mold, and the molding material is injected in the deformed state of the buffering member so as to form the molded member.

Sensor device having a buffer element between the molding and the sensing element

In a method of manufacturing a resin molded article, resin including a foaming agent is injected into a cavity defined in a mold assembly. Then, a movable mold of the mold assembly is moved to partly expand the cavity so that the foaming is promoted at the part where the cavity is expanded. Therefore, a high foamed portion having voids therein and a low foamed portion having an expansion ratio less than that of the high foamed portion are integrally formed in the resin molded article.

Resin molded articles and method of manufacturing the same

An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

Method and apparatus for forming a casting which includes an insert

A method of producing an insert-molding product in which an insert product is covered with a synthetic resin by arranging the insert product in a cavity of a mold is provided. The method includes holding the insert product by a holding pin, pouring a molten synthetic resin into the cavity, and retracting the holding pin. At least one moving pin is provided adjacent the holding pin. After the cavity is filled with the synthetic resin, the holding pin is retracted and the at least one moving pin is moved to extrude and introduce the synthetic resin into a space where the holding pin used to be positioned prior to its retraction from the cavity.

Insert-molding method for obtaining a resin-molded product

Method for forming a casting which includes an insert

Growing community of inventors

Kariya, Japan

Tsutomu Onoue