Hitachi-High-Technologies Corporation

Tsutomu Nakamura

Akitaka Makino

Susumu Tauchi

Michiaki Kobayashi

Hidenobu Tanimura

Tomohiro Ohashi

Yuya Mizobe

Takeo Uchino

Masashi Nakagome

A vacuum chamber includes: a vacuum vessel arranged at the backward side, where a wafer of a processing subject is processed inside an internal processing chamber; a transfer chamber arranged at the forward side, where said wafer is transferred at the inside thereof under atmospheric pressure; a cassette stage arranged at the forward of this transfer chamber, where a cassette storing said wafer is mounted; a lock chamber connected with said transfer chamber at the backward of said transfer chamber; a robot arranged inside said transfer chamber, where said wafer is transferred between said cassette and said lock chamber; and an aligning machine for making position of said wafer fit with the predetermined position, wherein the wafer is transferred to said lock chamber, after performing alignment of said wafer on said aligning machine, in the case where displacement amount of position of this wafer is larger than the predetermined value.

Vacuum chamber

A vacuum processing apparatus includes a transfer container for transferring a wafer in the internal space thereof reduced in pressure, a vacuum vessel coupled to the side wall of the vacuum vessel and including a processing chamber having a sample stage therein on which a wafer to be processed is mounted, a lid member opened or closed by rotation above the vacuum vessel, an inner chamber member arranged in the vacuum vessel and making up the inner wall of the processing chamber, and a jig coupled to the side wall of the vacuum vessel to lift and hold the inner chamber member by being coupled thereto. The jig includes a first joint portion having vertical and horizontal shafts, an extensible arm portion rotatable around each shaft of the first joint portion, and a second joint portion with the inner chamber member adapted to rotate around the horizontal axis thereof.

Vacuum processing apparatus

A plasma processing apparatus which contributes to reducing required time for maintenance and thereby to enhancing the efficiency of processing and that of apparatus operation is to be provided. A vacuum processing apparatus comprises a vacuum vessel in which a substrate-shaped sample is arranged in an internally arranged processing chamber in which the pressure is reduced; a transfer chamber to which the vacuum vessel is linked and through whose inside reduced in pressure the sample is transferred; a passage which establishes communication between the transfer chamber and the vacuum vessel in a state in which the transfer chamber and the processing chamber are linked to each other and through whose inside the sample not yet processed or already processed is transferred; and a covering member which is removably coupled to cover the internal wall face of the passage, wherein the sample is processed within the processing chamber with a plasma formed in the processing chamber.

Cover ring for a plasma processing apparatus

Grounded electrode for a plasma processing apparatus

Growing community of inventors

Hikari, Japan

Tsutomu Nakamura