Hitachi Automotive Systems, Ltd.

Hitachi, Ltd.

Hitachi Astemo Ltd.

Tsutomu Kono

Shinobu Tashiro

Keiji Hanzawa

Noboru Tokuyasu

Takeshi Morino

Takahiro Miki

Tsubasa Watanabe

Yuki Okamoto

Kimio Tatsuno

Toshiaki Ishii

Takayuki Yogo

Kazuyuki Fukuda

Tadaaki Ishikawa

Toshinori Hirataka

Toshimasa Miura

Hiroki Nakatsuchi

Koji Yoshida

Yuuki Okamoto

Akira Uenodan

Hiroaki Hoshika

Chihiro Kobayashi

Takeshil Kato

Satoshi Kaneko

Takeshi Kato

Toshiki Sugawara

Junichi Saeki

Keiji Suzuki

Norio Chujo

Naoki Matsushima

Yasunobu Matsuoka

Mitsuru Onoda

Madoka Minagawa

Binti Haridan Fatin Farhanah

Yasuaki Kageyama

Ryotaro Shimada

Kazuo Goto

Saori Hamamura

Takahiro Sato

Kenji Ikeda

Norio Ishitsuka

Hiroaki Kojima

Yuki Isoya

Makoto Iida

Hisashi Morooka

Masatoshi Ogata

Naozumi Hatada

Takahiro Yamamoto

Akihiro Yaguchi

Yoshimichi Nishimura

Masayuki Doki

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

Flow sensor, method for manufacturing flow sensor and flow sensor module

It is possible to suppress overcorrection. A physical quantity detecting device includes: a physical quantity detecting sensor that detects a physical quantity of a measurement target fluid and outputs a detection signal; a compensation amount calculation unit that calculates, by using the detection signal, a lead compensation amount used in lead compensation for the detection signal; and a gain control unit that adjusts the lead compensation amount based on a deviation that is an amount of change in lead compensation amount over time.

Physical quantity detecting device

To obtain a low-pressure-loss physical quantity detection device that can detect a plurality of physical quantities of intake air. A physical quantity detection device of the present invention that detects a plurality of physical quantities of a measured gas flowing in a main passage, the physical quantity detection device includes: a circuit board on which a sensor that detects the plurality of physical quantities and an electronic component that controls the physical quantities are mountable; a circuit board accommodating unit that accommodates the circuit board; and a sub-passage in which a flow sensor is disposed. The circuit board is accommodated in the circuit board accommodating unit on an upstream side of the sub-passage, and disposed in parallel with the measured gas flowing through the main passage.

Physical quantity detection device

To obtain a physical quantity detection device that can prevent a thermal influence on a sensor due to downsizing. A physical quantity detection deviceof the present invention includes a measuring unitprotruding from an inner wall of a main passagetoward a passage center of the main passage. The physical quantity detection deviceincludes at least one of a flow sensorthat detects a flow rate of a measured gas, an intake air temperature sensorthat detects temperature, a pressure sensorthat detects pressure, and a humidity sensorthat detects humidity, and the sensors are disposed along a protruding direction of the measuring unit

To obtain a physical-quantity detection device that reduces a variation in mounting position in a main passage. A physical-quantity detection deviceof the present invention is inserted into and disposed in a main passage, and includes a flangefixed to a seat surfaceof the main passage, and the flangeincludes a press-fitting portionfor positioning with respect to a seat surfaceside.

Physical-quantity detection device

A flow meter includes: a flat substrate; a housing that houses the substrate and has an open in at least one surface; a cover that covers the substrate and covers an open surface of the housing; a support that supports the substrate and is in contact with the cover and the substrate; and a fixing unit that connects the substrate and the housing, in which, in a first region and a second region formed by dividing the substrate into two parts at a center in a longitudinal direction, the support is disposed in the first region, and the fixing unit is disposed in the second region.

Flow meter

To obtain a physical quantity detection apparatus that can reduce the outer shape of a housing in size. A physical quantity detection apparatusdetects a plurality of physical quantities of gasto be measured flowing in a main passage. The physical quantity detection apparatushas a housingdisposed in the main passage, a circuit substrateinsert molded in the housing, and a plurality of detection sensors, andeach mounted on each of one face and the other face of the circuit substrate

Physical quantity detection apparatus and electronic apparatus

Provided is a flow analysis method capable of predicting a flow state of a composite resin material by taking into account a change in filler dispersion degree of the composite resin material. In a flow analysis method for a composite resin material having a filler and a resin, in a certain process of identifying a region in which the composite resin material flows and analyzing a flow, an exothermic reaction speed of the composite resin material in the region is computed using a filler dispersion degree in the composite resin material, a temperature and the filler dispersion degree of the composite resin material in the region is computed using the computed exothermic reaction speed, and an exothermic reaction speed in a process subsequent to a process is computed using the computed filler dispersion degree.

Flow analysis method

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

A thermal type air flow meter, capable of suppressing deformation of a base member at the time of molding to secure dimensional accuracy and reduce an influence of a dimension change on measuring accuracy, is to be placed in an intake passage of an internal combustion engine. The thermal type of air flow meter includes a resin component having a secondary passage into which part of the air passing through the intake passage can flow, and a circuit board configured to output a signal according to an air flow rate based on a signal from a flow rate detecting element disposed on the circuit board. The circuit board on which the flow rate detecting element is disposed is installed so that the flow rate detecting element is placed in the secondary passage. The resin component includes a board fixing part to which the circuit board is fixed, a secondary passage constituting part that is a part of the secondary passage, and ribs provided on a rear surface, which is a side opposite to a surface of the board fixing part, with the ribs forming a grid pattern.

Thermal type air flow meter having a reinforcing structure provided on the base member between the board fixing part and the secondary passage constituting part

To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element. A thermal flow meterof the present invention includes an air flow sensing portionthat detects a flow rate by performing heat transfer with a measurement target gas passing through the main passageusing a heat transfer surface, a temperature detection elementthat detects a temperature of the measurement target gas, a circuit packageobtained by connecting a processing unitthat processes signals of the air flow sensing portionand the temperature detection elementto a lead and sealing the processing unitusing a first molding resin through a first molding process, and a housingwhere the circuit packageis fixed using a second molding resin through a second molding process, wherein, in the circuit package, a thickness of a temperature detecting portionfor sealing the temperature detection elementis thinner than that of a package body portionfor sealing the processing unit

Thermal flow meter with thin resin portion sealing temperature detection element

A resin molding includes a semiconductor element, a circuit board, and a resin. A conductor connected to the semiconductor element is formed on the circuit board. The resin is adhered and integrated with the circuit board. A resin leakage suppression layer including a material having a higher thermal conductivity than that of a material forming a surface layer of the circuit board is provided in an edge region extending along a portion adhered to the resin in the circuit board and extending along at least one-side side surface of the resin.

Resin molding and sensor device

In a module in which a circuit board is integrally insert molded with a housing while semiconductor parts mounted on the circuit board are exposed, deformation of the circuit board caused by pressure on the circuit board by a mold for blocking the molding resin is reduced. In the module in which the circuit board is integrally insert molded with the housing while the semiconductor parts mounted on the circuit board are exposed, the deformation of the circuit board is reduced by placing a material, which has an elastic modulus smaller than the elastic modulus of the printed circuit board, in the projection area of the mold holding portion on the circuit board.

Sensor including a printed circuit board with semiconductor parts having a first and second resin

When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHPare in contact, and a resin MRdifferent in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHPthat is exposed from the resin MR, the resin MRis formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHPthat is exposed from the resins MR and MRcan be reduced in size.

Flow sensor and manufacturing method for the same

Growing community of inventors

Kawasaki, Japan

Tsutomu Kono