Shin-etsu Chemical Co., Ltd.

Nippon Kayaku Kabushiki Kaisha

Shin-estu Chemical Co., Ltd.

Osram Opto Semiconductors Gmbh

Philips Lumileds Lighting Company LLC

Niigata University

Shin-etsu Chemical C O., Ltd.

Tsutomu Kashiwagi

Toshio Shiobara

Takayuki Kusunoki

Yoshihira Hamamoto

Hiroshige Okinoshima

Junichi Sawada

Kinya Kodama

Yoshihiro Kawada

Takeshi Fukuda

Jörg Erich Sorg

Miyuki Wakao

Yuusuke Takamizawa

Manabu Ueno

Naofusa Miyagawa

Chie Sasaki

Hisashi Shimizu

Yoshihiro Tsutsumi

Yusuke Taguchi

Tomoyuki Mizunashi

Masanobu Sato

Hiroyuki Iguchi

Shinsuke Yamaguchi

Naosuke Taniguchi

Hayato Tanaka

Shinji Makikawa

Joerg Sorg

Yoshiaki Nishimura

Masachika Yoshino

Harald Jäger

Toshiyuki Sutou

Masataka Nakanishi

Harald Jaeger

Kenichi Kuboki

Norio Tsubokawa

Koki Matsumoto

Saiko Akahane

Tatsuya Yamazaki

Katsuyuki Imazawa

Seiya Yamada

Yasumasa Morita

Nicolaas Joseph Martin Van Leth

Kenichi Inafuku

Takahiro Hongo

Cheun Jye Yow

Wai Choo Chai

Shigeo Yamaguchi

One of the purposes of the present invention is to provide a radiation curable organosilicon resin composition which offers a cured product having a sufficient gas barrier property and which further has workability enough for use in spin coating or inkjetting. The present invention provides a radiation curable organosilicon resin composition comprising 100 parts by mass of (A) a (meth)acryloyloxy group-containing organosilane represented by the formula (1) which has a (meth)acryloyloxy group or a monovalent organic group having 4 to 25 carbon atoms and having one, two, or three of said (meth)acryloyloxy group, and 1 to 50 parts by mass of (B) a photopolymerization initiator.

Radiation curable organosilicon resin composition

An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.

Adhesive substrate, transfer device having adhesive substrate, and method for producing adhesive substrate

A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C):

Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof

A condensation-curable silicone composition provides a cured product having good performance at a low temperature, excellent resistance to a temperature change, and a crack resistance, and a semiconductor device has a high reliability, whose semiconductor element is encapsulated with the cured product. A condensation-curable silicone composition has (A) a branched organopolysiloxane represented by formula (1-1) or (1-2) with a short branch made of 1 to 4 siloxane units and (C) a condensation catalyst in a catalytic amount. Further, a condensation-curable silicone composition also has (B) an organopolysiloxane having a network structure and represented by formula (2). Further, a semiconductor device is provided with a cured product obtained by curing the condensation-curable silicone composition.

Condensation-curable silicone composition and a semiconductor device

A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided. An epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same

The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof

One of the purposes of the present invention is to provide a method for preparing an organopolysiloxane having a short branch chain. In particular, the purposes of the present invention is to provide a method for preparing an organopolysiloxane having a shorter side chain than a main chain, such as a siloxane side chain having 1 to 5 siloxane units. The present preparation methods are characterized in that the starting material is an organosiloxane which is represented by the formula (1) and has two hydrolyzable groups bonded to a silicon atom at one terminal. The present invention provides a method wherein an organo(poly)siloxane represented by the formula (1) is condensation reacted to prepare an organopolysiloxane represented by formula (2) which is then used as starting materials for introducing a branch, whereby a short siloxane side chain is efficiently introduced in the organopolysiloxane, while controlling a structure of the main chain.

Branched organopolysiloxane and a method for preparing the same

An epoxy resin represented by the following formula (1)  wherein Rrepresents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; Rrepresents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; Rrepresents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R, R, R, k, or m present in the formula may be the same or different from each other.

Silicone-modified epoxy resin and composition and cured article thereof

A polyorganosiloxane resin represented by the following general formula (5): (RSiO)(RSiO)(RSiO)(SiO)(5) wherein R is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group having 1 to 18 carbon atoms, and optionally having an oxygen, halogen, nitrogen or sulfur atom; l', m&#x2032; and o&#x2032; are, independently of each other, an integer of from 0 to 10,000; n&#x2032; is an integer of from 1 to 10,000; a total of l&#x2032;, m&#x2032; and n&#x2032; is from 2 to 30,000; and at least one R is a hydrogen atom and at least one R is an &#x2014;OX group in the molecule, wherein X is an alkyl group having 1 to 10 carbon atoms or an alkoxyalkyl group having 2 to 10 carbon atoms; and at least one hydrogen atom and at least one &#x2014;OX group bond to one and the same silicon atom.

Method for preparing a polyorganosiloxane and a polyorganosiloxane

An addition-curable silicone resin composition includes (A-1) a linear organopolysiloxane having at least two alkenyl groups per molecule, (A-2) a terminal alkenyl group-containing branched organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane with a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and one or more terminal SiH group per molecule of 5 wt % or less, and (C) an addition reaction catalyst. The composition can be cured to form a product which, when used as a die attach material for optical semiconductor devices, minimizes contamination of the gold electrode pads on LED chips and imparts a good wire bondability.

Addition-curable silicone resin composition and die attach material for optical semiconductor device

A silicone resin composition for sealing an optical semiconductor element includes (A) (A-1) an organopolysiloxane having a resin structure which contains at least two alkenyl groups in one molecule, the alkenyl groups being present at 10 to 70 mol % of the total substituent groups bonded to silicon atoms, (B) an organopolysiloxane oligomer having at least two alkenyl groups in one molecule and 2 to 5 silicon atoms, (C) an organohydrogenpolysiloxane which contains at least one hydrosilyl group and may have an alkoxy group or hydroxyl group in one molecule, and (D) an addition reaction catalyst, and is capable of providing a transparent cured product.

Silicone resin composition for sealing optical semiconductor element and optical semiconductor device

The invention provides an addition-curable silicone composition which provides a cured product having good performance at a low temperature and excellent resistance to a temperature change, and to provide a semiconductor device having a high reliability, whose semiconductor element is encapsulated with the cured product. The invention provides an addition-curable silicone composition comprising (A) a branched organopolysiloxane having at least two alkenyl groups and represented by the formula (1) with a short branch consisting of 1 to 4 siloxane units, (B) an organohydrogenpolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in component (B) to the number of the alkenyl groups in component (A) is 0.4 to 4, and (C) a hydrosilylation catalyst in a catalytic amount. The invention also provides a semiconductor device provided with a cured product obtained by curing the condensation-curable silicone composition.

Addition-curable silicone composition and a semiconductor device

An optoelectronic semiconductor component includes a connection carrier with at least two connection points and a carrier top that in a main side of the connection carrier, wherein the connection carrier configured with a silicone matrix with a fiber reinforcement, at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith, an annular potting body includes a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, and a glass body comprising a glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space between the semiconductor chip and the potting body.

UV- and heat-resistant optoelectronic semiconductor component

An optical semiconductor device in which an optical semiconductor element connected to a silver-plated copper lead frame is sealed with an addition curing silicone resin composition, the addition curing silicone resin composition having (A) organopolysiloxane that contains an aryl group and an alkenyl group and does not contain an epoxy group; (B) organohydrogenpolysiloxane that has at least two hydrosilyl groups per molecule and an aryl group, the organohydrogenpolysiloxane that contains 30 mol % or more of an HRSiOunit in a constituent unit having an amount that a molar ratio of the hydrosilyl group in the component (B) with respect to the alkenyl group in the component (A) is 0.70 to 1.00; and (C) a hydrosilylation catalyst having a catalytic amount.

Optical semiconductor device

Growing community of inventors

Annaka, Japan

Tsutomu Kashiwagi