Ebara Corporation

Kabushiki Kaisha Toshiba

Other

Nikon Corporation

Tsutomu Karimata

Shoji Yoshikawa

Nobuharu Noji

Tohru Satake

Hirosi Sobukawa

Masahiro Hatakeyama

Toshifumi Kimba

Mamoru Nakasuji

Takeshi Murakami

Shin Oowada

Mutsumi Saito

Kenji Watanabe

Muneki Hamashima

Yuichiro Yamazaki

Ichirota Nagahama

Takamitsu Nagai

Kenichi Suematsu

Ryo Tajima

Keiichi Tohyama

Toru Takagi

Yutaka Tabe

Takao Kato

Kiwamu Tsukamoto

Tatsuya Kohama

Kazuyoshi Sugihara

Hiroshi Nishimura

Takehide Hayashi

Naoto Kihara

Koji Mishima

Hiroaki Inoue

Yoshihiko Naito

Yasushi Toma

Yukiharu Okubo

Yoshiaki Kohama

Atsushi Onishi

Noboru Kobayashi

Norio Kimura

Kenji Nakamura

Junji Kunisawa

Satoshi Mori

Akihisa Hongo

Hiroshi Sobukawa

Shinichi Okada

Moriji Matsumoto

Takashi Ohara

Keisuke Matsushima

Nabuharu Noji

Mitsumi Saito

A vacuum connection mechanism includes: a main body part having a first opening and a first sub opening opened symmetrically in a first direction, and a second opening and a second sub opening opened symmetrically in a second direction; a first bellows connected to the first opening and to the end of which a first flange is provided; a first sub bellows connected to the first sub opening and to the end of which a first blind flange is provided; a first supporting member coupling the first flange and the first blind flange; a second bellows connected to the second opening and to the end of which a second flange is provided; a second sub bellows connected to the second sub opening and to the end of which a second blind flange is provided; and a second supporting member coupling the second flange and the second blind flange.

Vacuum connection mechanism and electron optical device

Provided is an electron beam irradiation apparatus including: an aligner configured to perform an alignment of an electron beam by deflecting the electron beam; a deflector having a plurality of electrodes and configured to deflect the electron beam after passing through the aligner; and an adjuster configured to adjust deflection caused by the aligner, wherein the adjuster is configured to perform, on each of the plurality of electrodes, detecting an image of the electron beam by applying a test voltage to one of the plurality of electrodes and applying a reference voltage to the other electrodes, determine a position shift of the electron beam based on each position of the image of the electron beam corresponding to each electrode, and adjust deflection of the aligner so as to cancel the position shift of the electron beam.

Electron beam irradiation apparatus and electron beam alignment method

An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.

Adjustment method and electron beam device

A coil-integrated-type yoke for realizing a deflector that can accurately deflect an orbit of an electron beam and a manufacturing method thereof are provided. There is provided a manufacturing method of a coil-integrated-type yoke, the manufacturing method including: a step of sequentially inserting a molding agent, a coil, and a spacer into a groove heading from a first surface toward a second surface of the yoke; and a step of polishing the first surface of the yoke and the spacer together.

Coil-integrated-type yoke and manufacturing method of the same

A gate valveincludes: a platehaving an opening portion; a platelocated opposite to the plate; a guide spaceformed between the plates; and a plateprovided in the space. The plateis slidable along a direction in which an opening portionis offset from the opening portionin the spacein a state in which the plateis pressed by the pressing portionand separated from the plate, and a position of the plateis fixed with respect to the platein the spacein a state in which the plateis pressed by the pressing portionand is in contact with the plate. The pressing portionseach have a bellows structure formed by diffusion-bonding metal platesandto each other.

Gate valve

An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.

Inspection device

An inspection apparatus capable of facilitating reduction in cost of the apparatus is provided. The inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held on a movable stage in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The inspection apparatus further includes: a linear motor that drives the movable stage; and a Helmholtz coil that causes a magnetic field for canceling a magnetic field caused by the linear motor when the movable stage is driven.

Inspection apparatus

A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.

Testing apparatus using charged particles and device manufacturing method using the testing apparatus

An inspection apparatus by an electron beam comprises: an electron-optical devicehaving an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical systems; a stage systemfor holding and moving the object relative to the electron-optical system; a mini-environment chamberfor supplying a clean gas to the object to prevent dust from contacting the object; a working chamberfor accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambersdisposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loaderfor transferring the object to the stage system through the loading chambers.

Inspection system by charged particle beam and method of manufacturing devices using the system

An electron beam inspection device observes a sample by irradiating the sample set on a stage with electron beams and detecting the electron beams from the sample. The electron beam inspection device has one electron column which irradiates the sample with the electron beams, and detects the electron beams from the sample. In this one electron column, a plurality of electron beam irradiation detecting systems are formed which each form electron beam paths in which the electron beams with which the sample is irradiated and the electron beams from the sample pass. The electron beam inspection device inspects the sample by simultaneously using a plurality of electron beam irradiation detecting systems and simultaneously irradiating the sample with the plurality of electron beams.

Sample observing device and sample observing method

A substrate inspection apparatus-(FIG.) of the present invention performs the following steps of: carrying a substrate 'S' to be inspected into an inspection chamber-; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage-with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system-; trapping secondary electrons emitted from said substrate via a secondary electron optical system-and guiding it to a detecting system-; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU-; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.

Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former

An inspection apparatus by an electron beam comprises: an electron-optical devicehaving an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage systemfor holding and moving the object relative to the electron-optical system; a mini-environment chamberfor supplying a clean gas to the object to prevent dust from contacting to the object; a working chamberfor accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambersdisposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loaderfor transferring the object to the stage system through the loading chambers.

An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectorsfor receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors, where the plurality of detectorsare disposed in the same chamber MC. The plurality of detectorscan be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector.

Detector and inspecting apparatus

Growing community of inventors

Kanagawa, Japan

Tsutomu Karimata