Hitachi, Ltd.

Hitachi Micro Eng. Ltd.

Tsutomu Imai

Kenichi Kasai

Mitugu Shirai

Kiyoshi Matsui

Akio Takahashi

Takayuki Ono

Masahiro Suzuki

Ryuji Watanabe

Osamu Miura

Morio Suzuki

Hideyuki Fukasawa

Toshitaka Murakawa

Takeshi Kuroda

Takeji Siokawa

Takeyuki Itabashi

Hitoshi Suzuki

Yukio Ookoshi

Haruo Akahoshi

Susumu Yoshida

Kensuke Amemiya

Yutaka Watanabe

Yuuichirou Ueno

Takashi Matsumoto

Takao Miwa

Norihito Yanagita

Ryohei Satoh

Fumiyuki Kobayashi

Shizuo Zushi

Toshihiro Kato

Junichi Katagiri

Mitsuo Miyamoto

Tomoyuki Seino

Masakazu Yamamoto

Michifumi Kawai

Takeshi Yamaguchi

Takaji Takenaka

Norio Sengoku

Takashi Itoh

Tetsuo Ogata

Tositada Netsu

Satoru Ezaki

Hideki Watanabe

Yukio Isobe

Hiroyuki Hidaka

Yoichi Daiko

Kouji Nakayama

Fumio Imahashi

Shinji Abe

Masashi Ohkubo

A radiological imaging apparatus which can keep detectors at a low temperature, improve a time resolution and an energy resolution and perform an accurate diagnosis is provided. In the radiological imaging apparatus, an imaging apparatus imaging a testing subject supported by a bed couples a detector board having placed thereon radiation detectors detecting radiations emitted from the testing subject and a signal processing board having placed thereon a signal processing circuit processing detection signals of the radiation detectors via an intermediate board by connectors, and separates a detector space including the radiation detectors and a signal processing circuit space including the signal processing circuit.

Radiological imaging apparatus and cooling method of same

When recording operation is stopped due to, for example, unexpected interruption of electric power supply in the course of the recording operation on a real time basis, a technique of repairing a moving picture and sound data recorded on a recording medium until the recording is stopped, to thereby restore management information data which enables random access and special reproduction is provided. A video/audio/management information multiplexing means is so implemented as to generate data required for generating management information data for allowing random access to the recording medium and effectuating special reproduction of the recording medium, for thereby multiplexing the data required for generating the management information data, encoded video data outputted from a video encoding means and encoded audio data outputted from an audio encoding means.

Apparatus and method for recording and reproducing information

A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.

Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer

A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.

Electronic device and multi-pin connector therefor

A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5&deg; or less, can provide a high wiring density and signal transmission performance.

Thin-film multilayer wiring board and production thereof

A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.

Multi-pin connector

A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.

Surface mounting structure

A multilayer circuit substrate with a circuit repairing function which has a circuit substrate having a circuit pattern and repair pattern on the inner layer via an inter-substrate insulation film and having circuit repairing areas for cutting and bonding the circuit on these patterns, a terminal bonding pad for bonding electronic circuit parts mounted on this substrate, and a conductive via hole for bonding said circuit pattern to the terminal bonding pad, wherein at least the circuit repairing area of the repair pattern and at least the circuit repairing area of said circuit pattern which are set on said inner layer are brought close to each other and positioned on the same plane.

Multilayer circuit substrate with circuit repairing function, and

Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.

Method of making multi-pin connector

A high-density multilayer printed circuit board is provided such that crosstalk noise between through holes is avoided and wiring efficiency is increased. Power supply through holes which connect to power supply pins of component parts are combined to make room for via holes in certain portions of the multilayer printed circuit board. These power supply through holes are subsequently restored into their original form. This permits via holes to exist at certain locations so that certain wiring layers can be interconnected. Additionally, by restoring the power supply through holes, crosstalk noise is reduced as the rear side of the multilayer printed circuit board is approached. Finally, dummy power supply lines can be provided to further reduce crosstalk noise. These dummy power supply lines are not connected to power supply pins of the component parts.

Multilayer printed circuit board

A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

LSI package board

A through hole is formed by a drill in a defective through hole in a board. An insulating resin is coated on the inner surface of the through hole and a cylindrical conductor is closely fixed with an adhesive to the hole h1 to form a reproduced through hole. Thereafter, as usual, a part lead is inserted into and soldered in the reproduced through hole to thereby recover the connection of the lead with the wiring circuit copper foil impaired by the recovering operation of the defective through hole using an external lead.

Methods of recovering a multi-layer printed circuit board

In a power supply network network of a printed circuit board, a through hole network for power supply electrically connected to main power supply pads connected with power supply cables is electrically and substantially independent of an internal network comprising networks of power supply layers on the like and a through hold network for load. Thereby, each of source currents supplied from the power supply cables reaches the through hole network for each load, once, via the through hold network for power supply and horizontal buses, therefore the dispersion in the drop of voltage across the main power supply pads and each of the loads is effectively decreased.

Power supply network of printed circuit board

In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.

Device for adjusting pressure loss of cooling air for an assembly of

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Hadano, Japan

Tsutomu Imai