Tokyo Electron Limited

Tokyo Electron Limi Ted

Nhk Spring Co., Ltd.

Tokyo Electron Yamanashi Limited

Nippon Valqua Industries, Ltd.

Sankyo Seisakusho Co.

Tokyo Electronics Limited

Sankyo Seisakusho Corporation

Tsutomu Hiroki

Takehiro Shindo

Shigeru Ishizawa

Wataru Machiyama

Hiroaki Saeki

Toshinao Kato

Keisuke Kondoh

Takaaki Matsuoka

Teruo Asakawa

Hiroshi Koizumi

Akinori Kitamura

Masayuki Noguchi

Kazuyoshi Matsuzaki

Ikuo Sawada

Toru Kimura

Katsuhiko Iwabuchi

Hiroshi Narushima

Isamu Sakuragi

Yoshiki Fukuhara

Shinya Sakurai

Masaaki Nose

Masanao Matsushita

Takehiro Nishiba

Hisayoshi Ito

Takehiro Nakayama

A substrate processing apparatus includes a stage on which a substrate to be processed is placed, a liquid supply unit for supplying liquid for controlling a temperature of the substrate to the stage, a flow path formed in the stage and through which the supplied liquid flows, a liquid receiving unit for receiving the liquid discharged from the flow path, a heater for heating the stage to a temperature higher than a usable temperature range of the liquid to remove deposits adhered to the stage, a gas supply unit for supplying a gas to the flow path, and a controller. The controller is configured to switch fluid in the flow path from the liquid supplied from the liquid supply unit to the gas supplied from the gas supply unit, and to control the heater to heat the stage after replacement of the fluid in the flow path with the gas.

Substrate processing apparatus and stage cleaning method

A stage includes a plate and a heat exchanger. The plate has a front surface, on which a substrate is mounted, and a rear surface. The heat exchanger is configured to individually supply a heat exchange medium to a plurality of two-dimensionally distributed and mutually non-inclusive regions of the rear surface of the plate and to recover the heat exchange medium thus supplied.

Stage, stage manufacturing method, and heat exchanger

There is provided a load lock chamber including: a plurality of stages on which a plurality of first substrates that are loaded at once by means of a second transfer mechanism are respectively mounted; a moving mechanism which, in a state in which the plurality of first substrates are respectively mounted on the plurality of stages, moves the plurality of stages to narrow the interval between the plurality of stages; and a rotating mechanism which, when the plurality of first substrates are unloaded one by one by means of a first transfer mechanism, rotates the plurality of stages with the narrowed interval about an axis, and causes the plurality of first substrates successively to become closer to the first transfer mechanism around the axis.

Substrate processing device and substrate transfer method

A heat transfer medium supply system includes valve units each alternately supplying a first and a second heat transfer medium to a corresponding zone of a stage. The valve unit includes a housing and a shaft. The housing has first and second inlets, and first and second outlets. The first and second inlets are respectively connected to a first and a second medium temperature controller. The first and second outlets are connected to the corresponding zone. The shaft is inserted in the housing and has first and second supply grooves. The first supply groove connects the first inlet to the first outlet when a rotation angle about a central axis of the shaft is within a first angle range, and the second supply groove connects the second inlet to the second outlet when the rotation angle about the central axis of the shaft is within a second angle range.

Heat transfer medium supply system and substrate processing apparatus

A stage includes a heat exchanger, a plate provided on the heat exchanger and including a first main surface and a second main surface opposite to each other, the plate having a plurality of through-holes extending in a plate thickness direction, and an electrostatic chuck having a top surface on which a substrate is mounted and a bottom surface attached to the first main surface. The heat exchanger includes a plurality of first tubes having a plurality of opening ends facing a plurality of regions on the bottom surface which are exposed to the respective through-holes and a plurality of second tubes communicating with the through-holes.

Stage and substrate processing apparatus

A stage includes a plate having a top surface on which a substrate is to be placed and a bottom surface; a plurality of first tubes each extending toward different regions of the bottom surface and providing opening ends facing the bottom surface; a partition wall defining a plurality of spaces surrounding the respective first tubes, the spaces forming a plurality of flow passages through which a heat exchange medium discharged from the first tubes flows; and a plurality of second tubes connected to the partition wall to communicate with the respective flow passages. The stage further includes a plurality of adjusting mechanisms provided in the respective flow passages. Each of the adjusting mechanisms is configured to be deformed depending on the temperature of the heat exchange medium in the corresponding flow passage to adjust the conductance of the flow passage in accordance with the temperature.

There is provided a system including a temperature-controllable stage, which includes: a disc-shaped plate having a front surface on which a substrate is mounted and a rear surface; a heat exchanger configured to individually supply a heat exchange medium to a plurality of regions two-dimensionally arranged to face the rear surface of the plate and configured to individually recover the heat exchange medium supplied to the regions, the plurality of regions being obtained by dividing a plurality of zones defined to face the rear surface of the plate in the heat exchanger; and a plurality of valve units configured to control, for each of the plurality of zones, the supply or cutoff of the heat exchange medium to the plurality of regions by the heat exchanger.

System including temperature-controllable stage, semiconductor manufacturing equipment and stage temperature control method

There is provided a temperature control system, including: a stage configured to support a workpiece and provided with a heat exchange medium flow path formed within the stage, the heat exchange medium flow path including a first end and a second end; a first valve; a second valve; a first heat exchange medium supply device including a supply port which supplies a first heat exchange medium adjusted to have a first temperature and a recovery port; a second heat exchange medium supply device including a supply port which supplies a second heat exchange medium adjusted to have a second temperature higher than the first temperature and a recovery port; and a control device configured to control the first and second valves such that the first and second heat exchange mediums are alternately supplied to the first end of the heat exchange medium flow path.

Temperature control system and temperature control method

A drive device is provided to include: a case; a first motor and a second motor having an output shaft extending along a first axial line in the case and a second axial line parallel to the first axial line in the case, respectively; a first output shaft including a first shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the first motor; a second output shaft including a second shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the second motor; a first sealing member located between the case and the outer peripheral surface of the first shaft body; and a second sealing member located between an inner peripheral surface of the first shaft body and an outer peripheral surface of the second shaft body.

Drive device and substrate processing system

Provided is a conveyance system that adjusts the position of a conveyed substrate, prevents damage resulting from the heat of another apparatus in a conveyance base, prevents insufficient electrical power of another apparatus in the conveyance base, and can move the conveyance base smoothly. A substrate processing system is provided with a conveyance chamber and a sliding box moving within the conveyance chamber. A plurality of processing modules are connected, and the sliding box is provided with: a conveyance arm that moves wafers; a servo motor that moves the conveyance arm; and a servo motor driver that controls the electrical power supplied to the servo motor. A servo motor controller that controls the servo motor driver is disposed outside a transfer module, and the servo motor driver and servo motor controller perform optical communication.

Conveyance base and conveyance system

A substrate processing apparatus for processing a substrate includes a transfer device which has a drive motor and transfers a substrate, a peripheral device which has a drive motor and loads and unloads the substrate in substrate-transfer operation of the transfer device, and a control device which conducts drive control on the drive motor of the transfer device and drive control of the drive motor of the peripheral device.

Substrate processing apparatus and substrate processing method

In the substrate holder, while holding a periphery portion of a semiconductor wafer, some of protruding portions having a grass shape on a pad main body hide beneath the semiconductor wafer, and the others of the protruding portions are exposed outside the semiconductor wafer. Also, the protruding portions hiding beneath the semiconductor wafer contact a rear surface of the semiconductor wafer, and sink the semiconductor wafer to a suitable depth via gravity, thereby holding the semiconductor wafer mainly in a length direction. In addition, some of protruding portions exposed near the periphery portion of the semiconductor wafer contact a side surface of the semiconductor wafer, thereby holding the semiconductor wafer mainly in a width direction.

Substrate transfer apparatus

A substrate processing system is provided with: a first transfer unit, which extends from a loader module to a first processing chamber for processing substrates, to transfer the substrates; and a second transfer unit, which is provided below or above the first transfer unit and extends from the loader module to a second processing chamber for processing substrates, to transfer the substrates. The first processing chamber and the second processing chamber do not overlap in the vertical direction, and are disposed at positions separated from each other in a plan view. At the same time, at least a part of the first transfer unit and at least a part of the second transfer unit overlap each other in the vertical direction.

Substrate processing system, transfer module, substrate processing method, and method for manufacturing semiconductor element

In one embodiment, a substrate transfer device is equipped with a chamber wall, a table, a linear motor transfer mechanism, an optical window, and a laser measuring instrument. The chamber wall defines a transfer space. The table is housed within the transfer space. It is possible for a substrate to be loaded on the table. The linear motor transfer mechanism moves the table within the transfer space, by a linear motor. The optical window is installed between the transfer space and the space to the outside of the transfer space. For example, the optical window is disposed so as to seal off an opening defined in the chamber wall. The laser measuring instrument irradiates a laser light through the optical window and towards the table, receives reflected light from the table, and measures the position of the table.

Growing community of inventors

Nirasaki, Japan

Tsutomu Hiroki