Shinko Electric Industries Co., Ltd.

Tsutomu Higuchi

Tomoharu Fujii

Masatoshi Akagawa

Shigeru Okamura

Takaharu Miyamoto

Yoshitaka Matsushita

Fumio Miyagawa

Takayoshi Wakabayashi

Tsuyoshi Sato

There is provided a semiconductor package that includes a metal plate, and a wiring substrate having an insulating substrate, signal wiring layer formed on one surface of the insulating substrate, and a ground plane formed integrally on other surface of the insulating substrate, whereby a surface of the ground plane side of the wiring substrate is adhered onto the metal plate. The signal wiring layer is constructed by a wiring line portion and a connection pad portion whose width is thicker than a width of the wiring line portion, and non-forming portion is provided in portion of the ground plane, which corresponds to the connection pad portion. In addition, a recess portion may be formed in portion of the metal plate, which correspond to the non-forming portion.

Semiconductor package and semiconductor device

A semiconductor device with an antenna including one or more antenna units for sending and receiving signals and a semiconductor element electrically connected to the antenna units, wherein the antenna units are formed by pressing or etching a thin metal sheet with substantially the same flat surface size as the semiconductor element, and the antenna units are integrally coupled to the surface of the semicondcutor element. The antenna units are formed in a plurality of layers separated by insulating layers, and the antenna units formed on the respective layers are connected electrically in series with each other.

Semiconductor device and fabrication method thereof

An IC card includes an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals. A semiconductor element is electrically connected to said innermost and outermost terminals, respectively. One of said innermost and outermost terminals having an accommodation hole in which said semiconductor element is accommodated. The semiconductor element and the antenna are supported to maintain their form by a supporting material made of biodegradable resin.

IC card, antenna frame for IC card and method for manufacturing the same

An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.

Non-contact type IC card and process for manufacturing same

A process for making a metal wall enclosure of a package for housing an electronic element. An elongated strip, to be formed as the metal sidewall of the enclosure, and a bottom plate, for closing an open end of the metal sidewall, are formed from a sheet of metal stock. At least one aperture is selectively provided in at least one of the bottom plate and the planar metal strip. The strip is prepared for folding, such as by transverse grooves formed in the strip along predetermined fold lines corresponding to corners of the metal sidewall, to facilitate folding of the strip into the desired configuration of the metal sidewall and with the opposite ends of the strip, as folded to form the metal sidewall, in abutting relationship. The abutting ends of the metal strip, as folded to form the metal sidewall, are affixed and hermetically sealed together and the lower edge of the metal sidewall, as formed from the folded strip, is affixed and hermetically sealed to the bottom plate to complete the metal wall enclosure. The at least one aperture is at a predetermined position in the metal wall enclosure and of a size for receiving a connector for providing a connection therethrough, and thus from the exterior of the package and through the enclosure, to the electronic element housed within the package.

Growing community of inventors

Nagano, Japan

Tsutomu Higuchi