Toyochem Co., Ltd.

Toyo Ink Sc Holdings Co., Ltd.

Artience Co., Ltd.

Tsutomu Hayasaka

Kazunori Matsudo

Shota Mori

Takahiro Matsuzawa

Daisuke Kishi

Kenji Ando

Hidenobu Kobayashi

Ryota Umezawa

Satoshi Nishinohara

An electromagnetic wave shielding sheet according to the present embodiments is an electromagnetic wave shielding sheet for forming an electromagnetic wave shielding layer used for a component-mounting substrate including a substrate, an electronic component and an electromagnetic wave shielding layer, in which the electromagnetic wave shielding sheet includes at least one of a conductive layer before thermal pressing of the electromagnetic wave reflection layer and a conductive layer before thermal pressing of the electromagnetic wave absorption layer, the conductive layer before thermal pressing of the electromagnetic wave reflection layer includes a binder resin and a conductive filler, and the conductive layer before thermal pressing of the electromagnetic wave absorption layer includes a binder resin and an electromagnetic wave absorption filler. The Young's modulus of the conductive layer at 23° C. is set to 10 to 700 MPa.

Electromagnetic wave shielding sheet

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

Electromagnetic wave shielding sheet and printed wiring board

An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 &#x3bc;m, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.

Electromagnetic-wave shielding sheet and electronic component-mounted substrate

An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board () according to the present invention includes a wiring circuit board (), a conductive adhesive layer (), and a metal reinforcing plate (). The conductive adhesive layer () is bonded to each of the wiring circuit board () and the metal reinforcing plate (). The metal reinforcing plate () includes a nickel layer () formed on a surface of a metal plate (). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer () is more than 3 and equal to or less than 20.

Printed wiring board, printed wiring board manufacturing method, and electronic device

Growing community of inventors

Tokyo, Japan

Tsutomu Hayasaka