Tokyo Electron Limited

Tsutomu Fukunaga

Kenichi Shigetomi

Yasuhiro Uchida

A substrate processing apparatus includes: a polishing pad that polishes a substrate; a pod that accommodates a polishing surface of the polishing pad, which is brought into contact with the substrate; an imaging unit that images the polishing surface of the polishing pad through the pod; and an image processing unit that processes image data imaged by the imaging unit to detect deterioration of the polishing pad.

Substrate processing apparatus, polishing pad inspecting device, and method for inspecting polishing pad

Disclosed is a heat treatment apparatus for performing a heat treatment on an object to-be-processed by a heater, which can inhibit variation in thermal histories among the objects to-be-processed. The heat treatment apparatus includes, among others, a correction part to correct a power control signal output from an adjusting unit so that a conduction rate of an AC voltage applied to a heater is decreased. Specifically, the correction is performed based on a value obtained by multiplying a first correction value with a second correction value, where the first correction value is generated according to a ratio of the voltage detection value of AC power source to a predetermined reference voltage, and the second correction value is generated according to a ratio of the resistance value of the heater to a predetermined reference resistance value.

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Kumamoto, Japan

Tsutomu Fukunaga