Matsushita Electric Industrial Co., Ltd.

Tsutomu Fujita

Toyoki Takemoto

Haruyasu Yamada

Tadao Komeda

Hironori Akamatsu

Hiroyuki Sakai

Hisakazu Kotani

Toshiki Mori

Masashi Agata

Naoki Kuroda

Ichiro Nakao

Kazunari Takahashi

Reiji Segawa

Hiroshi Yamamoto

Kenji Kawakita

Takao Kakiuchi

Hisashi Ogawa

Toshio Yamada

Kousaku Yano

Masanori Shirahama

Kazuyuki Sawada

Toyokazu Fujii

Kazuya Kikuchi

Kohsaku Yano

Yuichi Hirofuji

Shinji Fujii

Shuichi Tanimura

Shoichi Tanimura

Atsuko Akiyama

The semiconductor device of the invention includes a plurality of circuit blocks including a first circuit block and a second circuit block, a block parameter of the first circuit block being different from a block parameter of the second circuit block. In the semiconductor device, the first circuit block is formed on a first semiconductor chip, and the second circuit block is formed on a second semiconductor chip and is electrically connected with the first circuit block.

Semiconductor device and method for fabricating the same, memory core chip and memory peripheral circuit chip

In a semiconductor memory device with multiple memory cells, each including a charge storage device and two transfer devices for transferring its charge, these memory cells are accessible with no select signal provided externally. The memory device includes a clock generator for generating first and second mutually complementary clock signals. In response to the first and second clock signals, one of first word lines and one of second word lines are activated alternately. Specifically, the first clock signal makes a memory cell accessible through a first bit line by activating the first word line and first transistor, while the second clock signal makes the memory cell accessible through a second bit line by activating the second word line and second transistor.

Low latency dynamic random access memory

The semiconductor storage device of this invention includes memory cells each having two transistors and one storage capacitor. Each memory cell is connected with a first word line and a first bit line for a first port and a second word line and a second bit line for a second port. The first and second bit lines are alternately disposed in an open bit line configuration. In the operation of the semiconductor storage device, in a period when a first precharge signal for precharging each first bit line or a first sense amplifier activating signal for activating a first sense amplifier is kept in an active state, a second precharge signal for precharging each second bit line and a second sense amplifier activating signal for activating a second sense amplifier are both placed in an inactive state.

Semiconductor storage device

A cache memory including a first memory array and a main memory including a second memory array are integrated together on the same semiconductor substrate. Each memory cell in the first memory array is of a 2Tr1C type including: first and second transistors, the sources of which are connected together; and a data storage capacitor, one of the two electrodes of which is connected to the common source of the first and second transistors. Each memory cell in the second memory array is of a 1Tr1C type including: a third transistor; and a data storage capacitor, one of the two electrodes of which is connected to the source of the third transistor.

Semiconductor memory device

Semiconductor device and method for fabricating the same, memory core

A memory array divided into a plurality of sub-memory-arrays is disposed on a chip so that, if a specified sub-memory-array is selected by a sub-memory-array selecting circuit, a normal read/write operation is performed with respect to the sub-memory-array based on an address indicated by a group of external address signals. At the same time, a clock generator for self-refresh mounted on a chip generates a word-line basic clock for self-refresh and a word-line basic clock for refresh, thereby selecting the word lines in the sub-memory-arrays which have not been selected. Prior to a predetermined time at which the sub-memory-array subjected to a refresh operation is subsequently selected, a refresh halt signal is outputted so as to forcibly halt the refresh operation, thereby preventing insufficient recharging of a memory cell. Each of the plurality of sub-memory-arrays stores, of sequential sets of image data, data on one frame or one field.

Semiconductor memory, moving-picture storing memory, moving-picture

In an integrated circuit comprising an IIL and a high frequency npn bipolar transistor which has a deep p.sup.- -type base region 45 for its inverted npn output transistors, circuit elements such as a resistor part R, a capacitor part C, a diode part D and an isolated crossing connection part Cr are provided with deep p.sup.- -type regions 54, 54', 65', 71 and 82 which are formed at the same time with the p.sup.- -type region 45 in the IIL, and thereby, reliability of the circuit elements as well as characteristic thereof are improved, thereby further improving manufacturing yields.

Semiconductor integrated circuit

In a CVD contact formed on a shallow junction having a depth of 0.2 micron or less, the presence of aluminum generates a leakage current at the junction after heat treatment. In order to restrain the leakage current, a barrier metal is formed below the aluminum electrode to form an Al/barrier metal/CVDW (tungsten) structure. A contact free from junction leakage and having a high aspect ratio is thereby realized.

Method for fabricating semiconductor integrated circuit device using an

A method for filling a contact hole in which (i) a silicon dioxide layer is formed on a silicon substrate; (ii) a contact hole is formed in the silicon dioxide layer; (iii) polysilicon film is formed on the side and bottom surface portions of the contact hole; (iv) gas containing tungsten reacts with the film; and (v) the contact hole is filled up with tungsten.

Method for filling contact hole

In a semiconductor IC, a vertical pnp or npn transistor of a uniform characteristic and a high breakdown voltage is made by forming, for example, a p.sup.- -collector region (39) in an n-type epitaxial region, an n-well base region (41) formed in the p.sup.- -collector region (39) and a p-emitter region (42) formed in the n-well base region (41); and furthermore, for example as shown in FIG. 9, p.sup.- -regions (40) and (49) are formed simultaneously with the p.sup.- -collector region (39) and an n-region (53) is formed simultaneously with the n-well base region (41), thereby constituting IIL of superior characteristics and a high resistance device at the same time as forming of the vertical transistor without substantial increase of manufacturing steps; and in the similar way, by combining the p.sup.- -region and n-region formed in the above-mentioned simultaneous steps with other region formed simultaneously with the forming of the vertical transistor, high h.sub.FE transistor, high speed vertical npn transistor, cross-over devices, p-channel and/or n-channel MOS transistors can be formed within limited manufacturing steps.

Method of making semiconductor IC including polar transistors

Disclosed is a method for fabricating an interconnection structure comprising a step of depositing an Al or Al alloy film on a dielectric film by a sputtering method improved in step coverage, a step of processing said Al or Al alloy film or a layered metal film thereof with another metal film into a metal line, and a step of depositing a film of high melting point metal or alloy thereof on the top and side surfaces of said line.

Method for fabricating interconnection structure

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Osaka, Japan

Tsutomu Fujita