Mitsui Minings & Melting Co., Ltd.

Tsutomu Asai

Tetsuro Sato

Makoto Dobashi

Hisao Sakai

Susumu Takahashi

Yasuji Hara

Toshiko Yokota

Mitsuo Suzuki

Shinichi Obata

Toshifumi Matsushima

Fujio Kuwako

Kenichiro Iwakiri

Tetsurou Satoh

An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition:

Resin-coated copper foil, and printed wiring board using resin-coated copper foil

The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound further has composition which is free of halogen elements.

RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATION LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM

The invention provides a resin-coated composite foil characterized in that an organic insulating layer is disposed on an ultra-thin copper foil is disposed on a supporting metal layer through an intermediate organic release layer. The resin-coated composite foil is free from the peeling or blistering between the supporting metal foil and the ultra-thin copper foil during the production of a copper clad laminate.

Resin-coated composite foil, production and use thereof

In a process producing a multi-layer printed wiring board, an inner core having at least one wiring pattern on its surface and an outer layer of copper foil are laminated with an organic insulating layer interposed therebetween, a via hole is formed using a laser beam, and the outer copper foil and the inner wiring patterns are electrically connected to each other by depositing copper. The process is characterized in that the outer layer of copper foil has a thickness of no more than one-fifth of the thickness of the inner wiring pattern, but will not exceed 7 &mgr;m, preferably 4 &mgr;m. The hole is formed in both the copper foil and the insulating layer simultaneously by irradiating with a laser beam on the outer layer of copper foil.

Method for producing vias in the manufacture of printed circuit boards

A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm,after heating one hour at 180&deg; C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.

High tensile strength electrodeposited copper foil

There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.

Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board

A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.

Growing community of inventors

Ageo, Japan

Tsutomu Asai