Applied Materials, Inc.

Mosel Vitelic Corporation

Advanced Ion Beam Technology, Inc.

Aplex, Inc.

Tsungnan Cheng

William L Guthrie

Jeffrey S Marks

Robert D Tolles

Norm Shendon

Michael T Sherwood

Linh X Can

Harry Q Lee

Sen-Hou Ko

Daniel Tang

David L Chen

David E Weldon

Tzu-Shih Yen

Garry K Kwong

Semyon Spektor

H Alexander Anderson

Shou-sung Chang

Huey M Tzeng

Shou-Chen Kao

Gregory C Lee

Ethan C Wilson

Albert Hu

Ivan A Ocanada

Luis Lau

Siyuan Yang

Shu-Wong S Lee

In plasma doping a non-planar semiconductor device, a substrate having a non-planar semiconductor body formed thereon is obtained. The substrate having the non-planar semiconductor body may be placed into a chamber. A plasma may be formed in the chamber and the plasma may contain dopant ions. A first bias voltage may be generated to implant dopant ions into a region of the non-planar semiconductor body. A second bias voltage may be generated to implant dopant ions into the same region. In one example, the first bias voltage and the second bias voltage may be different.

Plasma doping a non-planar semiconductor device

Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.

Polishing pad shaping and patterning

Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.

Apparatus and method for distribution of slurry in a chemical mechanical polishing system

Apparatus and method for distribution of slurry in a chemical mechanical

A chemical mechanical polishing apparatus including a carrier head having an integral conditioning member is described. The conditioning member includes a conditioning surface that may selectively be moved into contact with a polishing surface of a polishing pad. The conditioning member may be connected to a surface of the carrier's retaining ring assembly. As a result, the polishing surface may be conditioned either continuously or intermittently when a substrate is loaded in the carrier for polishing.

Method and apparatus for conditioning a polishing pad in a chemical

A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.

Modular wafer polishing apparatus and method

A process using a retaining ring assembly of a carrier head to precompress a polishing pad to reduce or minimize the edge effect in a chemical mechanical polishing process.

Method and apparatus for using a retaining ring to control the edge

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Saratoga, CA, United States of America

Tsungnan Cheng