Au Optronics Corporation

Tsung-Tien Wu

Pin-Miao Liu

Yi-Fen Lan

Wen-Wei Yang

Chin-Yuan Ho

Tsung-Yi Lin

Kang-Hung Liu

Cheng-Chieh Chang

Kuo-Lung Lo

Ho-Cheng Lee

An-Thung Cho

Chu-Yu Liu

Chih-Che Kuo

Ze-Yu Yen

Chen-Chang Chen

Chih-Hao Lin

Chien-Cheng Chang

Jhao-Wun Chen

Hui-Yang Chuang

A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Micro pick up array and manufacturing method thereof

A light-emitting device, including a circuit substrate, a first light-emitting diode, and a first fixing structure, is provided. The circuit substrate includes a substrate, a first pad, a flat layer, and a first electrical connection material. The first pad and the flat layer are located on the substrate. The flat layer has a first opening overlapping the first pad. The first electrical connection material is located in the first opening and is electrically connected to the first pad. The first light-emitting diode is located on the flat layer and in contact with the first electrical connection material. The first fixing structure is located between the first light-emitting diode and the flat layer. The vertical projection of the first fixing structure on the substrate is located in the vertical projection of the first light-emitting diode on the substrate.

Light-emitting device

A display device and a manufacturing method of a display device are provided. The display device includes a substrate, a plurality of first light-emitting elements, and at least one second light-emitting element. The first light-emitting elements are arranged on the substrate. A plurality of first electrodes are provided on a surface of each of the first light-emitting elements facing away from the substrate. The second light-emitting element is disposed on the substrate. A plurality of second electrodes are provided on a surface of the second light-emitting element facing away from the substrate. An orthographic projection of the second light-emitting element on the substrate partially overlaps orthographic projections of the first light-emitting elements on the substrate.

Display device and manufacturing method of display device

A light-emitting diode display having sub-pixel regions is provided. Each of the sub-pixel region includes a substrate, first and second electrodes, a light-emitting diode, and at least one blocking wall. The substrate has an active device. The first and second electrodes are separately disposed on the substrate. The first electrode is electrically connected to the active device, and a horizontal distance between the first and second electrodes is W1. The light-emitting diode is disposed on the substrate and includes a semiconductor stack, and first and second pads. The first pad contacts the first electrode, the second pad contacts the second electrode, and a maximum thickness of the semiconductor stack is HThe blocking wall is disposed on the substrate and located between the first and second pads to prevent a contact therebetween. A height of the blocking wall is Hand a width thereof is WH&#x2264;&#xbd;Hand WW

Light-emitting diode display

A light-emitting substrate and a repair method thereof are provided. The light-emitting substrate includes a substrate, a first conductive line, a second conductive line, a signal line, an insulating layer, first to third light-emitting devices, and a first sub-conductive line. The first and second conductive lines and the signal line are disposed on the substrate. The insulating layer is disposed on the first and second conductive lines. The first to third light-emitting devices are disposed on the substrate. The first light-emitting device is disposed corresponding to the first conductive line. The second light-emitting device is disposed corresponding to the second conductive line. The first to third light-emitting devices are disposed corresponding to the signal line. The first sub-conductive line is disposed on the insulating layer. The first sub-conductive line is overlapped with the first and second conductive lines. The third light-emitting device is disposed corresponding to the first sub-conductive line.

Light-emitting substrate and repair method thereof

A light emitting diode panel including a first substrate, a second substrate and a plurality of display units is provided. The display units are disposed between the first substrate and the second substrate. One display unit has multiple first regions and a second region surrounded by the first regions and includes multiple first light emitting diodes, multiple control signal lines and a second light emitting diode. Every N first light emitting diodes construct one pixel unit located within one of the first regions, wherein N is an integer greater than 1. The control signal lines are disposed on the first substrate and each extends toward one first light emitting diode. The second light emitting diode is disposed on the first substrate, located within the second region, and surrounded by the first regions. The second light emitting diode is electrically connected to one of the control signal lines.

Light emitting diode panel and manufacturing method thereof

A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.

Light-emitting apparatus including sacrificial pattern and manufacturing method thereof

A transfer device including a first electrode set, a second electrode set, a shielding element, a driving circuit and an elastomer is provided. The first electrode set includes a first electrode configured to receive a first voltage and a second electrode configured to receive a second voltage and structurally separated from the first electrode, wherein a voltage difference exists between the first voltage and the second voltage. The second electrode set disposed adjacent to the first electrode set includes a third electrode configured to receive a third voltage and a fourth electrode configured to receive a fourth voltage and structurally separated from the third electrode, wherein a voltage difference exists between the third voltage and the fourth voltage. The shielding element is disposed on a substrate and located between the first electrode set and the second electrode set. The driving circuit is electrically connected to the first electrode set and the second electrode set. The elastomer covers the first electrode set and the second electrode set, wherein the elastomer has a transfer surface.

Transfer device

A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (&#x3bc;LED), a first conductive layer, and a second conductive layer. A light emitting surface of the &#x3bc;LED is away from the substrate. The &#x3bc;LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

Light emitting device and manufacturing method thereof

The present disclosure provides a display panel, which includes a first light-emitting unit, a first electrode line A, a second light-emitting unit, a second electrode line A, and a first electrode line B. The first light-emitting unit includes a first electrode A and a first electrode B located at both ends of the first light-emitting unit respectively. The first electrode line A is connected to the first electrode A. The second light-emitting unit is located on a first side of the first light-emitting unit and includes a second electrode A and a second electrode B located at both ends of the second light-emitting unit respectively. The second electrode line A is connected to the second electrode A, and the second electrode line A and the first electrode line A are independent in terms of signal. The first electrode line B is arranged between the first light-emitting unit and the second light-emitting unit and connected to the first electrode B and the second electrode B respectively.

Display panel

A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.

The present invention proposes a self-emission type display and a repairing method thereof. The self-emission type display includes a carrier substrate and a light-emitting element. The carrier substrate includes a first electrode, a second electrode, and a plurality of repairing electrodes. The first electrode has a plurality of first strip portions connected to a first level. The second electrode has a plurality of second strip portions connected to a second level. The first electrode is separated from the second electrode, and the first level is different from the second level. The repairing electrodes are electrically insulated from the first electrode and the second electrode. The light-emitting element is disposed on the carrier substrate and has a first connecting portion and a second connecting portion. The first connecting portion is electrically connected to the first level through the first strip portions. The second connecting portion is electrically connected to the second level through the second strip portions.

Self-emission type display and repairing method thereof

A display device of the present invention includes a light source layer and a sensing unit layer. The light source layer has a display side and a sensing side at the backside of the display side. The light source layer includes a plurality of first light sources generating a first light, and a plurality of second light sources generating a second light. The first light at least partially emits toward the sensing side; the second light at least partially emits toward the display side. A second wavelength of the second light is different from a first wavelength of the first light. The sensing unit layer is disposed at the sensing side of the light source layer. In a sensing mode, the plurality of the first light sources is activated to generate and provide the first light for the sensing unit layer. In a displaying mode, the plurality of the second light sources is activated to generate the second light for displaying an image at the display side.

Display module having double-sided illumination design

A light emitting device includes a substrate, a light emitting chip, a first electrode, and a second electrode. The light emitting chip includes a first and a second semiconductor layers. The first semiconductor layer is disposed on the substrate. The second semiconductor layer is stacked on the first semiconductor layer and forms a light emitting junction with the first semiconductor layer. The first electrode connects to the first semiconductor layer and the second electrode connects to the second semiconductor layer. The light emitting device may further include a transparent layer that is disposed on the substrate and surrounds and contacts the lateral of the light emitting chip. A refraction index of the transparent layer is between a refraction index of the light emitting chip and that of a vacuum. The first electrode may penetrate the second semiconductor layer to connect to the first semiconductor.

Light emitting device with a light emitting junction formed by stacking semiconductor layers

A pixel structure includes a plurality of sub-pixels. Each of the sub-pixels includes a first light-emitting diode (LED) and a second LED. The first LED is configured to emit a first color light. The second LED is configured to emit a second color light. Each of the first LED and the second LED includes an anode and a cathode. The anode of the first LED and the anode of the second LED are coupled to a same signal line. The cathode of the first LED and the cathode of the second LED are coupled to different signal lines.

Growing community of inventors

Hsin-Chu, Taiwan

Tsung-Tien Wu