Compal Electronics, Inc.

Tsung-Sheng Chuang

Chien-Min Chang

Wan-Li Chuang

Ju-Chen Chiu

Chih-Hua Liu

A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process with a first irradiating energy is performed on the adhesive layer. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process with a second irradiating energy is performed on the adhesive layer after the workpiece is punched, wherein the second irradiating energy intensity is higher than the first irradiating energy intensity.

Production method of workpiece and workpiece with three-dimensional pattern

A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.

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Taipei, Taiwan

Tsung-Sheng Chuang