Benq Corporation

Qisda Corporation

Tsung-Ping Hsu

Wei-lin Chen

Hung-Sheng Hu

Chung-Cheng Chou

In-Yao Lee

ShangShi Wu

Chih-Ching Chen

Yi-Jing Leu

Der-Rong Shyn

A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.

Method for fluid injector

Methods for fabricating fluid injection devices. A patterned sacrificial layer is formed on a substrate. A patterned first structural layer is formed on the substrate covering the sacrificial layer. At least one fluid actuator is formed on the structural layer. A first passivation layer is formed on the first structural covering the at least one fluid actuator. An under bump metal (UBM) layer is conformably formed on the first passivation layer. A patterned first photoresist is formed at a predetermined nozzle site and a contact opening site exposes the UBM layer. A second structural layer is formed on the UBM layer. An etching protective layer is formed on the second structural layer. The first photoresist is removed creating an opening at the nozzle site exposing the UBM layer. The UBM layer in the opening is removed.

Methods for fabricating fluid injection devices

A method for fabricating a fluid injection micro device. The method includes the steps of providing a substrate with an insulating layer thereon. A heater is formed on the insulating layer. A patterned conductive layer is formed on the heater and the insulating layer. A protective layer is formed on the conductive layer to insulate the conductive layer. An opening is formed by sequentially etching the protective layer, the insulating layer and the substrate. A patterned thick film, having a defined chamber, is formed on the protective layer. The back of the substrate is removed and thinned until the opening forms a through hole.

Fluid injection micro device and fabrication method thereof

A fluid injector and method of manufacturing the same. The fluid injector includes a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.

Fluid injector and method of manufacturing the same

A microinjector uses bubbles as virtual valves to eject droplets of different sizes. The microinjector is in fluid communications with a reservoir and has a substrate, an orifice layer, and a plurality of nozzles. The substrate has a manifold for receiving ink from the reservoir. The orifice layer is positioned on the top of the substrate so that a plurality of chambers are formed between the orifice layer and the top of the substrate. Each of the nozzles has an orifice and at least three bubble generating components. The bubble generating components are selectively driven by a driving circuit so that each nozzle can eject droplets of different sizes.

Microinjector for jetting droplets of different sizes

A surface isolation device for isolating a predetermined area of a second surface of a wafer from an etching solution while the etching solution etches a first surface of the wafer to form a plurality of manifolds in the wafer. The surface isolation device has a base for positioning the wafer, a fixture for fixing the wafer on the base, and an isolation ring positioned on the base for isolating the predetermined area from the etching solution. When the fixture fixes the wafer on the base, the wafer sticks to the isolation ring, forming a seal that isolates the predetermined area from the etching solution.

Surface isolation device

A gradational etching method for high density wafer production. The gradational etching method acts on a substrate having a first passivation layer and a second passivation layer on a top surface and a bottom surface, respectively, of the substrate. A first etching process is performed to simultaneously etch the substrate and the first passivation layer to remove the first passivation layer. Finally, a second etching process is performed to etch the substrate to a designated depth that is used to control the thickness of the wafer after the second etching process.

High density wafer production method

This present invention provides an ink jet printhead and method of delivering ink to the printhead. The printhead has a substrate, a nozzle layer, and a plurality of bubble generators. A plurality of first chambers and a plurality of second chambers are formed between the nozzle layer and the top of the substrate. A central ink flow channel and a periphery ink flow channel for delivering ink to the chambers are formed in the substrate. The characteristic of the present invention is positioning the central ink flow channel and the periphery ink flow channel together on the substrate so that the amount of the nozzles per unit area of the printhead is increased.

Compact printhead and method of delivering ink to the printhead

A jet, and a method thereof, use bubbles as virtual valves to eject droplets of different sizes. The jet is in fluid communication with a reservoir and has a substrate, an orifice layer, first nozzles, and second nozzles. The substrate has a manifold for receiving ink from the reservoir. The orifice layer is positioned on the top of the substrate to form first chambers and second chambers. First orifices of the first nozzles and second orifices of the second nozzles are formed on the orifice layer. The jet has at least one of following characteristics: (a) the first chambers are larger than the second chambers; (b) an interval between two heating units of the first nozzle is larger than an interval between two heating units of the second nozzle; and (c) the apertures of the first orifices are larger than the apertures of the second orifices.

Jet and method thereof for ejecting droplets of different sizes

An apparatus for using the bubble as a virtual valve to eject ink comprises a chamber, orifice, and heaters. The chamber, having a top surface and a bottom surface, is connected to the ink reservoir by a manifold. Two heaters, connected in series to a common electrode, are located on the bottom surface of the chamber. One heater having higher resistance is positioned adjacent to the manifold, and the other heater having lower resistance is positioned away from the manifold. When an electrical pulse is applied to activate the heaters, the heater close to the manifold heats up first, and generates a first bubble to isolate the ink flow between the chamber and manifold, thereby reducing the effects of cross talk. Subsequently, the heater away from the manifold generates the second bubble to pressurize the ink in the chamber with the first bubble, and the ink is ejected through the orifice. Then, the first bubble collapses, and breaks the isolation between the manifold and the chamber. The ink in the manifold immediately refills to the chamber.

Growing community of inventors

Jungli, Taiwan

Tsung-Ping Hsu