Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Shenzhen Goodix Technology Co., Ltd.

Foxconn Precision Components Co., Ltd.

Fu Zhun Precision Ind. (shenzhen) Co., Ltd.

Tsung-Lung Lee

Li He

Cheng-Tien Lai

Shenghua Wang

Xu-Hua Xiao

Shuai Jiang

ZiLi Zhang

Guang Yu

Dong Wang

You-Xue Liu

Zhi-Gang Liu

Shi-Song Zheng

Yi-San Liu

Wen-Xiang Zhang

Fu-Chiang Yang

Cheng Tien Lai

Liang Hui Li

Zi Li Zhang

The present application belongs to field of integrated circuit and discloses an electrostatic discharge protection circuit comprising a first N-type transistor and a second N-type transistor. The first N-type transistor comprises a first gate terminal coupled to a ground terminal; a first electrode terminal coupled to the first gate terminal; and a second electrode terminal. The second N-type transistor comprises a second gate terminal coupled to a metal pad; a third electrode terminal coupled to the second gate terminal; a fourth electrode terminal, coupled to the second electrode terminal; and a first deep N well, disposed under the third electrode terminal and the fourth electrode terminal. The ESD protection circuits provided by the embodiments of the present application have advantages of small circuit area and good ESD protection.

Electrostatic discharge protection circuit

The present application provides an electrostatic discharge protection circuit including a first N-type transistor, a second N-type transistor and a high-voltage tracing circuit. The high-voltage tracing circuit includes a first input terminal, a second input terminal and an output terminal. The first input terminal is coupled to the metal pad to receive a metal pad voltage. The second input terminal receives a supply voltage. The output terminal is coupled to the second N-type transistor and configured to output a high-voltage tracing voltage, wherein the high-voltage tracing voltage is larger than or equal to the metal pad voltage.

Electrostatic discharge protection circuit applied in integrated circuit

An LED lamp includes a heat dissipation apparatus, an LED module, a bulb and a reflector. The heat dissipation apparatus includes a first heat sink, a second heat sink and a heat conductor positioned between the first heat sink and the second heat sink. The LED module includes a plurality of LEDs mounted on the heat conductor. The bulb is seated on the first heat sink and the reflector is seated on the second heat sink. The reflector and the bulb together form a housing for receiving the LED module and the heat conductor therein. Heat pipes are used to thermally connect the heat conductor and the first and second heat sinks.

LED lamp

An LED lamp includes a lamp holder, a heat sink, a plurality of LED modules, a cover, an envelope and a sealing cushion. The lamp holder has a connecting portion at a bottom thereof adapted for engaging with a lamp socket to fix the LED lamp in position. The heat sink is disposed on the lamp holder. The LED modules are attached to a circumference of the heat sink. The cover is coupled to a top of the heat sink. The envelope encloses the heat sink and the LED modules therein and has a lower end engaging with the lamp holder and an upper end engaging with the cover. The sealing cushion is provided between at least one of the combinations of the lamp holder and the envelope, and of the cover and the envelope to prevent an entry of foreign matter.

LED lamp having a sealed structure

An LED lamp includes a heat sink (), a plurality of heat pipes () mounted on outer sidewalls () of the heat sink, and a plurality of LED modules () attached on the outer sidewalls of the heat sink with a portion of each LED module contacting a corresponding heat pipe directly. A plurality of fins () extend inwardly from an inner wall of the heat sink in a manner such that a through hole () is enclosed by the fins, thereby providing an airflow passage axially through the heat sink. By the use of the heat pipes, heat generated by the LED modules can be transferred to the heat sink evenly, whereby the heat can be dispersed to ambient air efficiently and rapidly.

LED lamp with a heat dissipation device

A liquid cooling device () includes a heat sink (), a reservoir () distant from the heat sink, a duct () connecting with the reservoir, a flexible tube () connected to the duct and the heat sink, and a heat-transfer member () in the liquid cooling device. The liquid cooling device is filled with liquid therein. The heat-transfer member is a heat pipe including an evaporating segment () fixed to the heat sink and a condensing segment () extending freely in the reservoir.

Liquid cooling device

An LED lamp assembly includes a receiving member and a pair of LED lamps. The receiving member has a pair of opposite slope surfaces. The LED lamps are mounted on the opposite slope surfaces of the receiving member. Each of the LED lamps includes a heat sink having a bottom defining a plurality of differently-angled planar surfaces. A plurality of LED modules is mounted on the planar surfaces of the heat sink, respectively.

LED lamp assembly

An LED lamp includes a transparent bulb, an LED module comprising a plurality of LEDs received in an inner space of the bulb, and a heat dissipation apparatus supporting and cooling the LED module. The heat dissipation device includes a heat sink having a hollow base and a plurality of fins extending from the base, a first heat conductor vertically supported by the heat sink, a second heat conductor horizontally mounted on the first heat conductor, and a heat pipe thermally connecting the heat sink, the first heat conductor and the second heat conductor together. The LEDs are positioned on the first heat conductor and the second heat conductor, respectively.

A heat pipe includes an outer pipe (), an inner pipe (), and a hermetic cap (). The outer pipe has an evaporating end () and a condensing end (). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap () is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

Heat pipe incorporating outer and inner pipes

A heat dissipation device for electronic devices on a substrate comprises a base contacting one of the electronic devices for absorbing heat therefrom. A plurality of fins arranged on the base for dissipating heat. A plurality of airflow channels is defined between the fins, and each channel defines an intake and an outlet. A fan is located adjacent to the intakes and provides airflow entering the channels through the intakes and leaving the channels through the outlets. A first guiding member is located adjacent to the outlets. The airflow out of the outlets is guided, by the first guiding member, to be deflected towards the substrate for cooling other electronic devices neighboring the one contacting with the base.

Heat dissipation device

A liquid cooling device () includes a heat sink (), a panel () distant from the heat sink, a heat transfer member includes a heat exchanger () thermally engaging with the heat sink and at least one heat pipe (), a duct () connecting with the panel, a flexible tube () connected to the duct and the heat exchanger. Therefore, the panel, the duct, the flexible tube and the heat exchanger cooperatively form a hermetical liquid container filled with liquid therein. The at least one heat pipe is extended in the liquid container and submerged in the liquid to transfer heat from one place near to the heat sink to another place in the panel.

A heat dissipation device includes a heat sink, a retention module and a clip securing the heat sink to the retention module. The retention module includes a bottom wall and a plurality of sidewalls surrounding the bottom wall. The heat sink includes a plurality of the fins and a plurality of passages defined therebetween. The heat sink is located on the bottom wall of the retention module. The sidewalls of the retention module surround a bottom portion of the heat sink. The sidewalls define a plurality of voids therein for an airflow generated by a fan mounted on the heat sink passing therethrough. The airflow flows through the heat sink and then the voids in the sidewalls of the retention module to cool electronic components located beside the retention module.

A cooling system () for a computer system () includes a housing () and a thermoelectric module () in the housing. The housing is hermetically connected to a computer case (). The thermoelectric module comprises a cold side () and a hot side () when subject to an electric voltage. A first fan () is for blowing hot air generated by a CPU () in the computer case to the cold side of the thermoelectric module. A second fan () is for blowing cold air from the cold side of the thermoelectric module to the CPU. A first heat sink () is mounted to the cold side of the thermoelectric module. A second heat sink () is mounted to the hot side of the thermoelectric module.

Cooling system for computer

A heat dissipation device includes a retention frame (), a heat sink () and a pair of wire clips (). The retention frame is mounted on a PCB () having an electronic component () thereon. The heat sink is surrounded in the retention frame. The heat sink includes a base () attached on the electronic component and a plurality of fins () extending from the base. The base defines holes () at opposite sides thereof along a length direction of the fins. Receiving spaces () are defined in the heat sink above the holes respectively. The clips respectively include resilient arms () received in the receiving spaces and pins () extending from the arms. The pins are received in the holes. A pair of latching portions () depends from each of the clips and are engaged with the retention frame, to thereby secure the heat sink to the electronic component.

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Tu-Cheng, Taiwan

Tsung-Lung Lee