Taiwan Semiconductor Manufacturing Comp. Ltd.

Visera Technologies Company Limited

Largan Medical Co., Ltd.

Tsung-Lin Wu

Tung-Heng Hsieh

Chin-Chuan Hsieh

Jiun-Ming Kuo

Min-Hsiung Chiang

Wu-Cheng Kuo

Kuo-Feng Lin

Che-Yuan Hsu

Yu-Jen Chen

Chen-Yi Huang

Kuang-Peng Lin

Chung-Lin Wang

Che-Yuan Che

An image sensor is provided. The image sensor includes a substrate having a first region and a second region adjacent to each other; and a first photoelectric conversion component disposed on the first region of the substrate, and the first photoelectric conversion component includes: a first metal layer formed on the substrate; a first photoelectric conversion layer formed on the first metal layer; and a second metal layer formed on the first photoelectric conversion layer.

Image sensor

An image sensor is provided. The image sensor includes a microlens array having a plurality of microlenses; and a sensor array having a plurality of photoelectric elements that are arranged into a plurality of macro pixels. Each macro pixel includes a first photoelectric element, a second photoelectric element, a third photoelectric element, and a fourth photoelectric element that receive incident light via a first microlens, a second microlens, a third microlens, and a fourth lens in the plurality of microlenses. The first microlens, the second microlens, the third microlens, and the fourth microlens in each macro pixel have a first initial offset, a second initial offset, a third initial offset, and a fourth initial offset, respectively. The first microlens and the second microlens in each of the plurality of macro pixels further have a first additional offset and a second additional offset, respectively.

Image sensor with shifted microlens array

An image sensor package includes a medium layer having a first surface and a second surface opposite to the first surface. The image sensor package also includes a metal-insulator-metal structure disposed on the first surface of the medium layer. The metal-insulator-metal structure includes a first metal layer, a first insulating layer, and a second metal layer, and the first insulating layer is disposed between the first metal layer and the second metal layer. The image sensor package further includes an optical filter disposed on the second surface of the medium layer.

Image sensor packages

A device includes an active region in a semiconductor substrate, a gate strip over and crossing the active region, and a jog over the active region and connected to the gate strip to form a continuous region. The jog is on a side of the gate strip. A first contact plug is at a same level as the gate strip, wherein the first contact plug is on the side of the gate strip. A second contact plug is over the jog and the first contact plug. The second contact plug electrically interconnects the first contact plug and the jog.

Jog design in integrated circuits

This invention provides a method of packaging and manufacturing a contact lens in a container, wherein the container comprises a central recess formed of a curved surface with a ring-shaped protruding portion surrounding the curved surface, the method comprising the steps of: providing the container; injecting a lens-forming monomer mixture into the central recess to form the contact lens along the curved surface of the central recess; combining the container and a hand-held section; pouring a solution into the container to immerse the contact lens in the container; and sealing the container with a lid for sealing the contact lens and the solution in the container; wherein the curved surface of the central recess has one or a plurality of continuous radii of curvature Rless than a radius of curvature Rof the contact lens in its hydrous state.

Method of packaging and manufacturing a contact lens in a container

Growing community of inventors

Taichung, Taiwan

Tsung-Lin Wu