United Microelectronics Corp.

Other

Utek Semiconductor Corporation

Unipac Optoelectronics Corporation

Tsung-Lin Lu

Ping-Chung Chung

Tsang-Jung Lin

Weng-Yi Chen

Jing-Yi Huang

Hunter Chung

Tso-Lung Lai

Ta-Shuang Kuan

Gary Kuan

P C Chuang

Chin-Hsien Chen

Hunter Chuang

Frank Chung

Chienfeng Chen

Yung-Chun Wen

Jack Yao

Yun-Sueng Liou

A locator for a material sheet comprises at least two oppositely disposed stoppers, and a slot sheet. Each of the stoppers provides a flat bearing surface and a slant surface extending outward and upward from the bearing surface with a junction between them. The slot sheet is disposed under the stoppers and joining to a bottom of the respective stopper. The distance between the junctions on the two stoppers is corresponding to the length of the slot sheet.

Locator for a material sheet

A method for removing extraneous matters from a stainless device is provided. The method includes the steps of (a) providing a container for holding a fluorine-containing neutral solution therein, (b) immersing said stainless device in said fluorine-containing neutral solution to remove said extraneous matters from said stainless device, and (c) heating and swirling said fluorine-containing solution. The fluorine-containing neutral solution is made from neutralizing hydrofluoric acid (HF) with ammonium hydroxide (NH,OH), neutralizing hydrofluoric acid (HF) with ammonium fluoride (NH,F), or dissolving ammonium acid fluoride (NH,F) in a deionized water (DIW).

Method for removing extraneous matter by using fluorine-containing solution

A semiconductor wafer cassette mapper. A photo-detecting array is used as a receiver. During a mapping process, an accurate and complex driving system is not necessary. The invention provides a semiconductor wafer cassette mapper. A strip light source is used as an emitter and a photo-detecting array is used as a receiver for a semiconductor wafer cassette mapper. During the mapping process, the strip light source, the photo-detecting array and the wafer cassette do not need to move for scanning. The receiver obtains an information about all wafers in the wafer cassette by receiving all signals at one time, so that a mapping time is reduced. The invention provides another semiconductor wafer cassette mapper. A parallel scanning light source serves as an emitter and a photo-detecting array serves as a receiver of semiconductor wafer cassette mapper. During the mapping process, the parallel scanning light source moves quickly to scan the wafers in the wafer cassette. The method can reduce the mapping time.

Wafer mapping apparatus

A slit valve with safety detect device to prevent clipping, used to reduce the wafer damaged by the slit valve of the seal plate, further to have the function of the safety interlock and cost down the production. This invention mainly includes a plurality of sensor to detect that whether something in the range of the seal plate moving or not. The sensor consisted of an emitter and a receiver for detecting. If there are something in the range, the moving seal plate will stop moving, avoid the wafer damaged by the seal plate and to cost down.

Slit valve with safety detect device

An exhaust gas treatment apparatus for treating exhaust gases generated in semiconductor manufacturing processes. It includes a main pipe, a U pipe, a discharge pipe and a tank. The main pipe has an inlet to receive exhaust gases, a heater surrounding the main pipe to heat the exhaust gases to form exhaust gas powder, a sprinkler to spray cooling water to cool the heated exhaust gases to form vapor and waste water and an outlet to discharge vapor and waste water into the U pipe. The U pipe has a first connector connecting with the main pipe and a second connector connecting with the discharging pipe. The tank is located below the U pipe under the first connector for receiving lump type exhaust gas powder scrapping from the inside wall of the main pipe. The U pipe will not be blocked by the lump type exhaust gas powder so that exhaust gas treatment efficiency won't be harmfully affected.

Exhaust gas treatment apparatus

A method for improving the uniformity of wafer-to-wafer film thicknesses. Before depositing films, shower heads in a PECVD system is heated to production temperature to make the entire system (including the shower heads) reach a stable temperature in coordination with heating of a heater block. Subsequently, a gas source, output via the shower heads, is provided, and then a plasma of the gas source is generated to form a film on the wafer due to the temperatures of the shower heads remain constant during wafers deposition. Therefore, the problem of the uneven thicknesses of films among wafers is resolved. Moreover, if the heating of the shower heads by use of a plasma (which can also be used to heat the heater block) and the heater block is concurrently performed after the preventive maintenance (PM) or open chamber cleaning of the PECVD system, the heating time of the heater block can be further shortened.

Method for improving the uniformity of wafer-to-wafer film thickness

A method for planarizing a damascence structure, comprises using two polishing procedure to remove the redundant metal layer. The method comprises depositing a dielectric layer over a wafer. A photolithography and etching procedure is then performed to form trenchs on the dielectric layer. Then, a metal layer is deposited over the dielectric layer and fills the trenchs. Thereafter, a electrical polishing and chemical mechanical polishing method is performed to remove metal layer until the dielectric layer is exposed. The invention is capable of reducing the dishing and erosion effects occurred on the metal layer.

Method for planarizing a damascene structure

A method is proposed for use in a chamber used in IC fabrication to adjust for parallel alignment between a shower head and a heater platform in the chamber, so that later the deposition process performed in the chamber can result in an evenly deposited layer on the wafer. This method is characterized by the provision of a plurality of displacement gauges between the shower head and the heater platform, with the heater platform being adjusted in such a manner as to allow all the distance readings from the displacement gauges to be substantially equal to a predetermined fixed value. This not only allows the shower head and the heater platform to be aligned and parallel to each other, but also allows them to be separated by a predetermined, fixed distance. The parallel alignment allows all deposition processes subsequently performed in the chamber to provide an evenly deposited layer on the wafer, and the fixed distance between the shower head and the heater platform allows the wafers fabricated from different chambers to be consistent in quality.

Growing community of inventors

Tainan Hsien, Taiwan

Tsung-Lin Lu