Acer Inc.

Hon Hai Precision Industry Co., Ltd.

Phison Electronics Corporation

Scienbizip Consulting(shenzhen)co., Ltd.

Miics & Partners (shenzhen) Co., Ltd.

Tsung-Ju Wu

Jen-Tsorng Chang

Kin-Lu Wong

Yi-Cheng Lin

Hsin-Pei Hsieh

Ping-Chuan Lin

Hsiang-Jui Huang

Ping-Yu Hsieh

A data writing method, a memory control circuit unit, and a memory storage apparatus are provided. The method includes: receiving a write command from a host system; and determining whether to write a data corresponding to the write command into a first area or a second area according to a write amplification factor of the first area, where if it is determined to write the data into the second area, copying the written data to the first area after writing the data.

Data writing method, memory control circuit unit and memory storage apparatus

A removable key board for keying in on a touch panel, includes an insulating spacer defining a plurality of receiving holes, a plurality of supporting pillars in the receiving holes and a plurality of electrical connecting pads configured for electrically connecting to the touch panel and arranged on one side of the insulating spacer. Pressing each key on the removable keyboard applies an input touch to the touch panel. A portable electronic device is also provided.

Key board and portable electronic device with key board

A high density sensor module includes a first substrate, a plurality of first sensors positioned on the first substrate, a plurality of first conductive rods positioned on the corresponding first sensors, a first package resin member covering the first sensors and one end of each of the first conductive rods, a second substrate positioned on the first package resin member, a plurality of second sensors positioned on the second substrate, and a second package resin member covering the second sensors and another end of each of the first conductive rods. The first conductive rods pass through the first package resin member and the second substrate. The high density sensor module has a two-layer structure to increase the number of the sensors such that the sensing density and resolution of the high-density sensor module are increased.

High density sensor module

A high-density sensor module includes a substrate with a printed circuit board, a first supporting member disposed on a upper surface of the printed circuit board, the first supporting member includes at least one first sensing channel with a first right sidewall, at least one sensor disposed on the first right sidewall and electrically connected to the printed circuit board, and at least one first conductive unit arranged in the first sensing channel. The angle between the first right sidewall and the upper surface of the printed circuit board is not less than 90&#xb0;. When the first conductive unit is subjected to a pressure from outsides, the first conductive unit slides along a direction toward the upper surface of the printed circuit board and presses the sensors, and the pressure is conductive from the first conductive unit to the sensor. The sensing density and sensing resolution are enhanced.

A communication device including a supporting plate and an antenna system is provided. The supporting plate includes a conductive plate and a non-conductive plate. The conductive plate has a first edge and a second edge. The antenna system includes at least two antennas, which are both disposed at the first edge of the conductive plate and operate in at least a first band. A distance between the first edge and the second edge of the conductive plate is about 0.25 wavelength of the lowest frequency in the first band, and the distance is smaller than a length of the first edge.

Communication device and antenna system therein

An antenna structure having a ground element and an antenna element is provided. The antenna element is disposed on a dielectric substrate, and includes a first radiation portion, a second radiation portion, and a spiral metal line. An end of the first radiation portion is a feeding point of the antenna element, and another end is open. An end of the second radiation portion is electrically coupled to the ground element, and the length of the second radiation portion is greater than that of the first radiation portion. The first radiation portion is surrounded by the second radiation portion. An end of the spiral metal line is coupled to the first radiation portion. The spiral metal line contributes a parallel resonance outside the antenna's operating band, and results in a resonant mode generated within the antenna element's operating band such that the operating bandwidth of the antenna element is increased.

Growing community of inventors

Taipei, Taiwan

Tsung-Ju Wu