Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsinghua University

Tsung-Ju Chen

Chi On Chui

Shu-Han Chen

Chun-Heng Chen

Xiong-Fei Yu

Ta-Hsiang Kung

Da-Yuan Lee

Fan-Gang Tseng

Jui-Chia Chang

Yi-Hsin Ting

Han-Shen Wang

Hao-Ming Tang

In a method of manufacturing a semiconductor device, a fin structure is formed by patterning a semiconductor layer, an isolation insulating layer is formed such that an upper portion of the fin structure protrudes from the isolation insulating layer, a gate dielectric layer is formed by a deposition process, a nitridation operation is performed on the gate dielectric layer, and a gate electrode layer is formed over the gate dielectric layer. The gate dielectric layer as formed includes silicon oxide, and the nitridation operation comprises a plasma nitridation operation using a Ngas and a NHgas.

Method of manufacturing semiconductor devices and semiconductor devices

A method may include forming a dummy dielectric layer over a substrate, and forming a dummy gate over the dummy dielectric layer. The method may also include forming a first spacer adjacent the dummy gate, and removing the dummy gate to form a cavity, where the cavity is defined at least in part by the first spacer. The method may also include performing a plasma treatment on portions of the first spacer, where the plasma treatment causes a material composition of the portions of the first spacer to change from a first material composition to a second material composition. The method may also include etching the portions of the first spacer having the second material composition to remove the portions of the first spacer having the second material composition, and filling the cavity with conductive materials to form a gate structure.

Replacement gate methods that include treating spacers to widen gate

A method includes forming a dummy gate oxide on a wafer, and the dummy gate oxide is formed on a sidewall and a top surface of a protruding semiconductor fin in the wafer. The formation of the dummy gate oxide may include a Plasma Enhanced Chemical Vapor Deposition (PECVD) process in a deposition chamber, and the PECVD process includes applying a Radio Frequency (RF) power to a conductive plate below the wafer. The method further includes forming a dummy gate electrode over the dummy gate oxide, removing the dummy gate electrode and the dummy gate oxide to form a trench between opposing gate spacers, and forming a replacement gate in the trench.

Non-conformal gate oxide formation on FinFET

In an embodiment, a structure includes: a nano-structure; an epitaxial source/drain region adjacent the nano-structure; a gate dielectric wrapped around the nano-structure; a gate electrode over the gate dielectric, the gate electrode having an upper portion and a lower portion, a first width of the upper portion increasing continually in a first direction extending away from a top surface of the nano-structure, a second width of the lower portion being constant along the first direction; and a gate spacer between the gate dielectric and the epitaxial source/drain region.

Semiconductor devices having funnel-shaped gate structures

Semiconductor devices having gate structures with slanted sidewalls

Semiconductor device and method

An apparatus for cell observation and a method for cell collection using the same are disclosed. The apparatus for cell selection comprises a first substrate having an opening; and a second substrate having a photoresist unit disposed on a surface thereof, wherein the photoresist unit comprises at least one notch and defines a space which is interconnected with the notch and corresponds to the opening of the first substrate.

Apparatus for cell observation and method for cell collection using the same

Growing community of inventors

Hsinchu, Taiwan

Tsung-Ju Chen