Siliconware Precision Industries Co., Ltd.

Other

Novatek Microelectronics Corp.

Largan Precision Co., Ltd.

Hiwin Technologies Corporation

Advantek Health Tech Co., Ltd.

Tsung-Hsien Tsai

Chih-Hsien Chiu

Chien-Cheng Lin

Hsin-Lung Chung

Heng-Cheng Chu

Chao-Ya Yang

Chia-Yang Chen

Yude Chu

Ming-Fan Tsai

Hao-Ju Fang

Chun-Chi Ke

Jen-Ti Peng

Cho-Hsin Chang

Chih-Yuan Shih

Yueh-Chiung Chang

Tsung-Li Lin

Chi-Pin Tsai

Chia-Hao Hsu

Yu-Cheng Chen

Chih-Wei Chen

Yu-Hua Chen

Wei-Chih Wang

Wen-Jung Tsai

Chien-Chih Lee

Ming-Yao Lin

Shu-Wei Chang

Chi-Liang Shih

Hui-Chen Chen

Cheng-Lung Wu

Yu-Wei Yeh

Yung-I Chang

Chih-Ming Cheng

Sheng-Ming Yang

Hsueh-Han Chen

Chih-Sheng Tsai

Xuan-Wei Zhang

Yien-Lin Kuo

Hsiu-Yun Liu

Chun-Mu Yan

Wei-Chen Chien

Ping-Hung Liao

An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

Electronic package and method for manufacturing the same

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Electronic package

An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

Method for fabricating electronic package structure

The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.

A magnetron mechanism of an unpowered treadmill contains: a driving body, a one-way transmission element, and a magnetron mechanism. The driving body includes a frame, a connection fence, a front wheel assembly, and a connection shaft. The one-way transmission element is mounted on the connection fence of the frame. The magnetron mechanism is fixed on the connection fence and includes a rotary shaft, a drive wheel, a driven wheel, a belt, a flywheel, a resistance element, and an adjustment unit. The resistance element has a pair of fixing sheets and multiple magnetic parts. Each of the multiple magnetic parts has a rotatable connection portion. The adjustment unit has a steel cable, an end of which is connected with the resistance element so that the steel cable pulls the resistance element to swing along the rotatable connection portion.

Magnetron mechanism of unpowered treadmill

A zeroing structure applicable to an adjustable diplexer includes a substrate, holder, motor, lead screw, displacement plate, stop element and interference element. The holder is disposed on the substrate. The motor is disposed on the holder. The lead screw is rotatably disposed on the holder and connected to the motor, and thus rotation of the lead screw is driven by the motor. The displacement plate is movably disposed on the substrate and helically connected to the lead screw so as to undergo linear motion between a first position and a second position relative to the substrate when guided and driven by the motor. The stop element is disposed on the lead screw. The interference element is disposed on the displacement plate and at the position that allows the interference element to come into contact with the stop element when the displacement plate is at the first position. The zeroing structure enables the adjustable diplexer operable at an adjustable center frequency to perform mechanical zeroing and enables primary or auxiliary confirmation of zeroing detection. Furthermore, the zeroing structure is highly reliable and incurs low cost.

Zeroing structure applicable to adjustable diplexer

A novel miniaturized horizontal split-wave orthomode transducer includes a common channel portion, a first polarized channel portion and a second polarized channel portion, and the centers of the openings of the first polarized channel and the second polarized channel are coaxially and respectively arranged on two opposite sides of the common channel portion to save the bend and extended structure at the rear end of the horizontal split-wave orthomode transducer and also save the occupied space since there is no need to guide signals in one of the polarization directions to the rear and return the signals, so as to further achieve the effects of improving the flexibility of installing the transducer, providing a good isolation between electromagnetic signals in different polarization directions and preventing the interference occurred between the electromagnetic signals.

Miniaturized horizontal split-wave orthomode transducer

An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

Electronic package structure

Electronic package structure and fabrication method thereof

An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.

Electronic package and fabrication method thereof

A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages

A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.

Fabrication method of package having ESD and EMI preventing functions

A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.

Method of manufacturing semiconductor package

A circulation member positioning structure for a ball screw includes a nut and a circulation member. The nut has a threaded channel, a socket, and a positioning notch. The socket is provided on a wall of the threaded channel and the positioning notch is provided on a wall of socket. The circulation member has a circulation portion, a circulation track, and a positioning protrusion. The circulation portion is provided in the socket of the nut. The circulation track is distributed over one lateral of the circulation portion and connects with the threaded channel of the nut. The positioning protrusion is provided on an opposite lateral of the circulation portion for being engaged with the positioning notch of the nut. Thereby, the circulation member positioning structure helps to simplify the assembling work of the circulation member and to remain the nut small despite the insertion of the circulation member.

Circulation member positioning structure for ball screw

Semiconductor package having metal layer

Growing community of inventors

Taichung, Taiwan

Tsung-Hsien Tsai