Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsung-Han Kuo

Wei-Ming Wang

Po-Shu Wang

Chung-Chuan Tseng

Li-Hsin Chu

Zhi-Wei Zhuang

A system and method for reducing particle contamination on substrates during a deposition process using a particle control system is disclosed here. In one embodiment, a film deposition system includes: a processing chamber sealable to create a pressurized environment and configured to contain a plasma, a target and a substrate in the pressurized environment; and a particle control unit, wherein the particle control unit is configured to provide an external force to each of at least one charged atom and at least one contamination particle in the plasma, wherein the at least one charged atom and the at last one contamination particle are generated by the target when it is in direct contact with the plasma, wherein the external force is configured to direct the at least one charged atom to a top surface of the substrate and to direct the at least one contamination particle away from the top surface of the substrate.

System and method for particle control in MRAM processing

Some embodiments of the present disclosure provide a back side illuminated (BSI) image sensor. BSI image sensor includes a semiconductive substrate, a dielectric layer over the semiconductive substrate, and a pixel region. The pixel region includes a transistor disposed at a front side of the semiconductive substrate. The transistor includes a gate structure and at least a source region or a drain region. The transistor is coupled to a contact disposed in the dielectric layer. An oxide layer covers the gate structure and at least the source region or the drain region. A nitride layer covers the gate structure and at least the source region or the drain region. A color filter is disposed at a back side of the semiconductive substrate.

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Taipei, Taiwan

Tsung-Han Kuo