Industrial Technology Research Institute

Industrial Technology Institute

Tsung H Wang

Jing-Pin Pan

Syh-Ming Ho

Han L Chen

Shih-Ming Chen

Chein-Chung Sun

Sheng-Fa Yeh

Deng-Tswen Shieh

Wei Chi Chang

Jing P Pan

Ker M Chen

Gwo Y Shiau

Shiow Huey Jang Suen

Shy-Ming Ho

Rong-Jer Lee

A fireproof battery module including a plurality of battery cells and at least one fireproof layer. The battery cells are electrically connected to one another. The at least one fireproof layer is located between two of the plurality of battery cells that are adjacent to each other. The fireproof layer includes a heat absorbing part and a heat insulation part that are connected to each other. The heat absorbing part includes a vaporizable material and a thermal conductivity of the heat insulation part is lower than a thermal conductivity of the heat absorbing part.

Fireproof battery module and fireproof layer

A polyimide/copper foil laminate prepared using a polyimide composition that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof. The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an ahsesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced. Furthermore, many of the problems caused by the inferior chemical and/or physical properties of the adhesive layer are completely eliminated.

Polyimide composition for polyimide/copper foil laminate

A wet etching process for forming vias or pre-designed patterns in organic polymeric layers such as fully or substantially fully cured polyimide layers which are used as circuit carriers in laminated integrated circuits by placing said organic polymeric layer in an etching bath containing two electrodes immersed in an etching solution and applying an alternating current having a voltage of about 0.3 to 1.0 volt and a frequency of about 60 Hz, or a direct current of about 0.8 to 20 volt to the electrodes. The etching solution contains acid or metallic hydroxide and, optionally, 3-15 wt % N-methyl-2-pyrrolidone. The present invention provides a fast and safe etching technique without the need to use the toxic and explosive etching chemicals such as hydrazine hydrate or ethylene diamine.

Process for etching organic polymeric materials

A polyimide composition for use in making polyimide/copper foil laminate that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an adhesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced. Furthermore, many of the problems caused by the inferior chemical and/or physical properties of the adhesive layer are completely eliminated.

A polyimide adhesive composition is a reaction product of polyamic acid and bismaleimide (I) modified by barbituric acid (II) or the derivatives thereof. Once the present composition is directly coated onto copper foil, the bonding force is greatly improved as compared to compositions without (II) or (I) and (II). Therefore, the adhesive normally used in the manufacture of flexible printed circuits boards and tape automated bonding (TAB) is no longer necessary.

Polyimide adhesive composition including barbituric acid modifier

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Taichung Hsien, Taiwan

Tsung H Wang