Industrial Technology Research Institute

Tsung-Fu Tsai

Tao-Chih Chang

Chau-Jie Zhan

Wen-Chih Chen

Jing-Yao Chang

Huan-Chun Fu

A dished micro-bump structure with self-aligning functions is provided. The micro-bump structure takes advantage of the central concavity for achieving the accurate alignment with the corresponding micro-bumps.

Micro-bump structure

A stacked-type piezoelectric device includes a stack of piezoelectric layers, plural conductive layers, a first contact hole, a second contact hole, and plural insulating portions. The piezoelectric layers are disposed between the conductive layers. The first and second contact holes penetrate the piezoelectric layers and the conductive layers, and each of first and second contact holes is filled with a conductive material. Every insulating portion is formed at one conductive layer. Two adjacent insulating portions are respectively formed at the outer rims of the first and second contact holes, to electrically isolate the conductive layer (in which the insulating portion is formed) from the conductive material in the contact hole.

Stacked-type piezoelectric device and method for manufacturing the same

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.

Growing community of inventors

Yunlin County, Taiwan

Tsung-Fu Tsai